Issued Patents All Time
Showing 176–200 of 313 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6777268 | Method of fabricating tape attachment chip-on-board assemblies | — | 2004-08-17 |
| 6774480 | Method and structure for manufacturing improved yield semiconductor packaged devices | — | 2004-08-10 |
| 6770164 | Method for attaching a semiconductor die to a substrate | Edward A. Schrock | 2004-08-03 |
| 6770981 | Composite interposer for BGA packages | Edward A. Schrock | 2004-08-03 |
| 6768209 | UNDERFILL COMPOUNDS INCLUDING ELECTRICALLY CHARGED FILLER ELEMENTS, MICROELECTRONIC DEVICES HAVING UNDERFILL COMPOUNDS INCLUDING ELECTRICALLY CHARGED FILLER ELEMENTS, AND METHODS OF UNDERFILLING MICROELECTRONIC DEVICES | Curtis Hollingshead, Warren M. Farnworth | 2004-07-27 |
| 6765652 | Forming thermally curable materials on a support structure in an electronic device | — | 2004-07-20 |
| 6762485 | Plastic lead frames for semiconductor devices | Jerrold L. King | 2004-07-13 |
| 6757176 | Circuit board | Yong Du | 2004-06-29 |
| 6750070 | Process for manufacturing flip-chip semiconductor assembly | Chad A. Cobbley, John VanNortwick, Bret K. Street | 2004-06-15 |
| 6740821 | Selectively configurable circuit board | David Y. Kao | 2004-05-25 |
| 6737299 | Thermally conductive adhesive tape for semiconductor devices and method for using the same | — | 2004-05-18 |
| 6724073 | Plastic lead frames for semiconductor devices and packages including same | Jerrold L. King | 2004-04-20 |
| 6717259 | METHODS EMPLOYING HYBRID ADHESIVE MATERIALS TO SECURE COMPONENTS OF SEMICONDUCTOR DEVICE ASSEMBLIES AND PACKAGES TO ONE ANOTHER AND ASSEMBLIES AND PACKAGES INCLUDING COMPONENTS SECURED TO ONE ANOTHER WITH SUCH HYBRID ADHESIVE MATERIALS | W. Jeff Reeder | 2004-04-06 |
| 6710456 | Composite interposer for BGA packages | Edward A. Schrock | 2004-03-23 |
| 6710462 | Method of pressure curing for reducing voids in a die attach bondline and applications thereof | — | 2004-03-23 |
| 6709896 | Methods for use in packaging applications using an adhesive composition | Chad A. Cobbley, Edward A. Schrock | 2004-03-23 |
| 6706559 | Method of attaching a leadframe to singulated semiconductor dice | Syed Sajid Ahmad, Walter L. Moden | 2004-03-16 |
| 6707147 | Substrates and assemblies including pre-applied adhesion promoter | Brenton L. Dickey | 2004-03-16 |
| 6700183 | Low temperature die attaching material for BOC packages and products comprising such material | — | 2004-03-02 |
| 6699928 | Adhesive composition for use in packaging applications | Chad A. Cobbley, Edward A. Schrock | 2004-03-02 |
| 6691406 | Methods of die attachment for BOC and F/C surface mount | Casey L. Prindivill | 2004-02-17 |
| 6689635 | Apparatus and method for face-to-face connection of a die to a substrate with polymer electrodes | Chad A. Cobbley | 2004-02-10 |
| 6684717 | High resolution pressure-sensing device having an insulating flexible matrix loaded with filler particles | Zhiqiang Wu | 2004-02-03 |
| 6685083 | Ultrasonic vibration mode for wire bonding | Zhiqiang Wu | 2004-02-03 |
| 6669781 | Method and apparatus for improving stencil/screen print quality | Chad A. Cobbley, John VanNortwick | 2003-12-30 |