Issued Patents All Time
Showing 201–225 of 313 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6664175 | Method of forming ruthenium interconnect for an integrated circuit | Li Li | 2003-12-16 |
| 6662440 | Z-axis electrical contact for microelectric devices | Edward A. Schrock | 2003-12-16 |
| 6661104 | Microelectronic assembly with pre-disposed fill material and associated method of manufacture | Jason L. Fuller, Alan G. Wood | 2003-12-09 |
| 6647620 | Method of making center bond flip chip semiconductor carrier | Alan G. Wood | 2003-11-18 |
| 6646354 | Adhesive composition and methods for use in packaging applications | Chad A. Cobbley, Edward A. Schrock | 2003-11-11 |
| 6641669 | Method and apparatus for improving stencil/screen print quality | Chad A. Cobbley, John VanNortwick | 2003-11-04 |
| 6630400 | Method for electroless plating a contact pad | Li Li | 2003-10-07 |
| 6616864 | Z-axis electrical contact for microelectronic devices | Edward A. Schrock | 2003-09-09 |
| 6610591 | Methods of ball grid array | Salman Akram | 2003-08-26 |
| 6607599 | Apparatus for improving stencil/screen print quality | Chad A. Cobbley, John VanNortwick | 2003-08-19 |
| 6601294 | Method for making a packaged semiconductor device | Mark S. Johnson | 2003-08-05 |
| 6602730 | Method for gravitation-assisted control of spread of viscous material applied to a substrate | Syed Sajid Ahmad | 2003-08-05 |
| 6599365 | Apparatus for improving stencil/screen print quality | Chad A. Cobbley, John VanNortwick | 2003-07-29 |
| 6589812 | Pre-applied adhesion promoter | Brenton L. Dickey | 2003-07-08 |
| 6586277 | Method and structure for manufacturing improved yield semiconductor packaged devices | — | 2003-07-01 |
| 6582994 | Passivation layer for packaged integrated circuits | Zhiping Yin | 2003-06-24 |
| 6579744 | Electrical interconnections, methods of conducting electricity, and methods of reducing horizontal conductivity within an anisotropic conductive adhesive | — | 2003-06-17 |
| 6576495 | Microelectronic assembly with pre-disposed fill material and associated method of manufacture | Jason L. Fuller, Alan G. Wood | 2003-06-10 |
| 6566253 | Method of making electrical interconnection for attachment to a substrate | — | 2003-05-20 |
| 6561044 | High resolution pressure-sensing device having an insulating flexible matrix loaded with filler particles | Zhigiang Wu | 2003-05-13 |
| 6562277 | Method and apparatus for attaching a workpiece to a workpiece support | Ed A. Schrock | 2003-05-13 |
| 6551863 | Flip chip dip coating encapsulant | Farrah J. Johnson | 2003-04-22 |
| 6548376 | Methods of thinning microelectronic workpieces | — | 2003-04-15 |
| 6548764 | Semiconductor packages and methods for making the same | Casey Prindiville, Bret K. Street | 2003-04-15 |
| 6544864 | METHODS EMPLOYING HYBRID ADHESIVE MATERIALS TO SECURE COMPONENTS OF SEMICONDUCTOR DEVICE ASSEMBLIES AND PACKAGES TO ONE ANOTHER AND ASSEMBLIES AND PACKAGES INCLUDING COMPONENTS SECURED TO ONE ANOTHER WITH SUCH HYBRID ADHESIVE MATERIALS | W. Jeff Reeder | 2003-04-08 |