Issued Patents All Time
Showing 251–275 of 313 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6451116 | Apparatus for electroless plating a contact pad | Li Li | 2002-09-17 |
| 6440777 | Method of depositing a thermoplastic polymer in semiconductor fabrication | Chad A. Cobbley, John VanNortwick | 2002-08-27 |
| 6426552 | METHODS EMPLOYING HYBRID ADHESIVE MATERIALS TO SECURE COMPONENTS OF SEMICONDUCTOR DEVICE ASSEMBLIES AND PACKAGES TO ONE ANOTHER AND ASSEMBLIES AND PACKAGES INCLUDING COMPONENTS SECURED TO ONE ANOTHER WITH SUCH HYBRID ADHESIVE MATERIALS | W. Jeff Reeder | 2002-07-30 |
| 6423579 | Apparatus and methods for providing substrate structures having metallic layers for microelectronics devices | Walter L. Moden | 2002-07-23 |
| 6413102 | Center bond flip chip semiconductor carrier and a method of making and using it | Alan G. Wood | 2002-07-02 |
| 6414869 | Quad in-line memory module | David Y. Kao | 2002-07-02 |
| 6406944 | Method of fabricating a reinforcement of lead bonding in microelectronic packages | — | 2002-06-18 |
| 6388199 | Selectively adjusting surface tension of soldermask material | Partrick Tandy | 2002-05-14 |
| 6380632 | Center bond flip-chip semiconductor device and method of making it | Alan G. Wood | 2002-04-30 |
| 6380626 | Semiconductor device for attachment to a semiconductor substrate | — | 2002-04-30 |
| 6367685 | Ultrasonic vibration mode for wire bonding | Zhiqiang Wu | 2002-04-09 |
| 6368897 | Method for manufactoring and using stencil/screen | Chad A. Cobbley, John VanNortwick | 2002-04-09 |
| 6369602 | Method for in-line testing of flip-chip semiconductor assemblies | Chad A. Cobbley, John VanNortwick, Bret K. Street | 2002-04-09 |
| 6363796 | High resolution pressure-sensing device having an insulating flexible matrix loaded with filler particles | Zhiqiang Wu | 2002-04-02 |
| 6365842 | Electrical circuits, circuits, and electrical couplings | — | 2002-04-02 |
| 6359334 | Thermally conductive adhesive tape for semiconductor devices and method using the same | — | 2002-03-19 |
| 6355504 | Electrical interconnections, methods of conducting electricity, and methods of reducing horizontal conductivity within an anisotropic conductive adhesive | — | 2002-03-12 |
| 6353268 | Semiconductor die attachment method and apparatus | Chad A. Cobbley, Ed A. Schrock | 2002-03-05 |
| 6346750 | Resistance-reducing conductive adhesives for attachment of electronic components | Whonchee Lee | 2002-02-12 |
| 6346152 | Method and apparatus for applying adhesives to a lead frame | Walter L. Moden, Syed Sajid Ahmad, Gregory M. Chapman | 2002-02-12 |
| 6346151 | Method and apparatus for electroless plating a contact pad | Li Li | 2002-02-12 |
| 6343019 | Apparatus and method of stacking die on a substrate | Chad A. Cobbley | 2002-01-29 |
| 6336973 | Apparatus and method for modifying the configuration of an exposed surface of a viscous fluid | Walter L. Moden, Syed Sajid Ahmad, Gregory M. Chapman | 2002-01-08 |
| 6329832 | Method for in-line testing of flip-chip semiconductor assemblies | Chad A. Cobbley, John VanNortwick, Bret K. Street | 2001-12-11 |
| 6323543 | Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication | Jerrold L. King | 2001-11-27 |