Issued Patents All Time
Showing 301–313 of 313 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6083768 | Gravitationally-assisted control of spread of viscous material applied to semiconductor assembly components | Syed Sajid Ahmad | 2000-07-04 |
| 6073497 | High resolution pressure sensing device having an insulating flexible matrix loaded with filler particles | Zhiqiang Wu | 2000-06-13 |
| 6064120 | Apparatus and method for face-to-face connection of a die face to a substrate with polymer electrodes | Chad A. Cobbley | 2000-05-16 |
| 6051879 | Electrical interconnection for attachment to a substrate | — | 2000-04-18 |
| 6048656 | Void-free underfill of surface mounted chips | Salman Akram | 2000-04-11 |
| 6048755 | Method for fabricating BGA package using substrate with patterned solder mask open in die attach area | Edward A. Schrock | 2000-04-11 |
| 6023666 | In-line method of monitoring die attach material adhesive weight | John C. Fernandez | 2000-02-08 |
| 6017776 | Method of attaching a leadframe to singulated semiconductor dice | Syed Sajid Ahmad, Walter L. Moden | 2000-01-25 |
| 6013535 | Method for applying adhesives to a lead frame | Walter L. Moden, Syed Sajid Ahmad, Gregory M. Chapman | 2000-01-11 |
| 6011307 | Anisotropic conductive interconnect material for electronic devices, method of use and resulting product | Zhiqiang Wu, David Y. Kao, Rongsheng Yang | 2000-01-04 |
| 5960712 | Screens for use in a screen printing system | Syed Sajid Ahmad | 1999-10-05 |
| 5925260 | Removal of polyimide from dies and wafers | — | 1999-07-20 |
| 5879965 | Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication | Jerrold L. King | 1999-03-09 |