Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9064973 | Die attached to a support member by a plurality of adhesive members | Craig T. Clyne | 2015-06-23 |
| 8278751 | Methods of adhering microfeature workpieces, including a chip, to a support member | Craig T. Clyne | 2012-10-02 |
| 7518237 | Microfeature systems including adhered microfeature workpieces and support members | Craig T. Clyne | 2009-04-14 |
| 6303985 | Semiconductor lead frame and package with stiffened mounting paddle | Charles E. Larson | 2001-10-16 |
| 6023666 | In-line method of monitoring die attach material adhesive weight | Tongbi Jiang | 2000-02-08 |