Issued Patents All Time
Showing 276–300 of 313 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6316285 | Passivation layer for packaged integrated circuits | Zhiping Yin | 2001-11-13 |
| 6316824 | Plastic leads frames for semiconductor devices | Jerrold L. King | 2001-11-13 |
| 6312977 | Method of attaching a leadframe to singulated semiconductor dice | Syed Sajid Ahmad, Walter L. Moden | 2001-11-06 |
| 6303500 | Method and apparatus for electroless plating a contact pad | Li Li | 2001-10-16 |
| 6294410 | Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication | Jerrold L. King | 2001-09-25 |
| 6288885 | Method and apparatus for electrostatic discharge protection for printed circuit boards | David Y. Kao | 2001-09-11 |
| 6264486 | Zero insertion force sockets using negative thermal expansion materials | Zhiqiang Wu | 2001-07-24 |
| 6244498 | Ultrasonic vibration mode for wire bonding | Zhiqiang Wu | 2001-06-12 |
| 6245594 | Methods for forming conductive micro-bumps and recessed contacts for flip-chip technology and method of flip-chip assembly | Zhiqiang Wu, Salman Akram | 2001-06-12 |
| 6238223 | Method of depositing a thermoplastic polymer in semiconductor fabrication | Chad A. Cobbley, John VanNortwick | 2001-05-29 |
| 6239489 | Reinforcement of lead bonding in microelectronics packages | — | 2001-05-29 |
| 6207559 | Method of making a semiconductor device for attachment to a semiconductor substrate | — | 2001-03-27 |
| 6208519 | Thermally enhanced semiconductor package | Mark S. Johnson | 2001-03-27 |
| 6200833 | Method of attaching a leadframe to singulated semiconductor dice | Syed Sajid Ahmad, Walter L. Moden | 2001-03-13 |
| 6184064 | Semiconductor die back side surface and method of fabrication | Chad A. Cobbley | 2001-02-06 |
| 6165856 | Using an organic layer as an ion implantation mask when forming shallow source/drain region | David Y. Kao | 2000-12-26 |
| 6164993 | Zero insertion force sockets using negative thermal expansion materials | Zhigiang Wu | 2000-12-26 |
| 6137063 | Electrical interconnections | — | 2000-10-24 |
| 6124151 | Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication | Jerrold L. King | 2000-09-26 |
| 6118080 | Z-axis electrical contact for microelectronic devices | Edward A. Schrock | 2000-09-12 |
| 6113709 | Method of preparing a conductive bonding pad | Li Li | 2000-09-05 |
| 6110805 | Method and apparatus for attaching a workpiece to a workpiece support | Ed A. Schrock | 2000-08-29 |
| 6108228 | Quad in-line memory module | David Y. Kao | 2000-08-22 |
| 6091136 | Plastic lead frames for semiconductor devices | Jerrold L. King | 2000-07-18 |
| 6084311 | Method and apparatus for reducing resin bleed during the formation of a semiconductor device | Ed A. Schrock, John VanNortwick | 2000-07-04 |