Issued Patents All Time
Showing 226–250 of 313 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6544820 | Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication | Jerrold L. King | 2003-04-08 |
| 6545498 | Method for in-line testing of flip-chip semiconductor assemblies | Chad A. Cobbley, John VanNortwick, Bret K. Street | 2003-04-08 |
| 6541872 | Multi-layered adhesive for attaching a semiconductor die to a substrate | Edward A. Schrock | 2003-04-01 |
| 6539815 | High resolution pressure-sensing device having an insulating flexible matrix loaded with filler particles | Zhigiang Wu | 2003-04-01 |
| 6539286 | Fluid level sensor | — | 2003-03-25 |
| 6538898 | Method and apparatus of die attachment for BOC and F/C surface mount | Casey L. Prindivill | 2003-03-25 |
| 6531340 | Low temperature die attaching material for BOC packages | — | 2003-03-11 |
| 6524891 | Method of pressure curing for reducing voids in a die attach bondline and applications thereof | — | 2003-02-25 |
| 6520030 | High resolution pressure sensing device having an insulating flexible matrix loaded with filler particles | Zhiqiang Wu | 2003-02-18 |
| 6521287 | Method for manufacturing improved stencil/screen | Chad A. Cobbley, John VanNortwick | 2003-02-18 |
| 6518094 | Center bond flip-chip semiconductor device and method of making it | Alan G. Wood | 2003-02-11 |
| 6515355 | Passivation layer for packaged integrated circuits | Zhiping Yin | 2003-02-04 |
| 6514795 | Packaged stacked semiconductor die and method of preparing same | Michael Connell | 2003-02-04 |
| 6508890 | Method of enhancing the conductivity of a conductive surface | Li Li | 2003-01-21 |
| 6506628 | Method of attaching a leadframe to singulated semiconductor dice | Syed Sajid Ahmad, Walter L. Moden | 2003-01-14 |
| 6501170 | Substrates and assemblies including pre-applied adhesion promoter | Brenton L. Dickey | 2002-12-31 |
| 6492713 | Gravitationally assisted control of spread of viscous material applied to semiconductor assembly components | Syed Sajid Ahmad | 2002-12-10 |
| 6489681 | Gravitationally-assisted control of spread of viscous material applied to semiconductor assembly components | Syed Sajid Ahmad | 2002-12-03 |
| 6485778 | Method of applying an adhesive material to lead fingers of a lead frame | Walter L. Moden, Syed Sajid Ahmad, Gregory M. Chapman | 2002-11-26 |
| 6472901 | Method for in-line testing of flip-chip semiconductor assemblies | Chad A. Cobbley, John VanNortwick, Bret K. Street | 2002-10-29 |
| 6465314 | Semiconductor processing methods | David Y. Kao | 2002-10-15 |
| 6458624 | Resistance-reducing conductive adhesives for attachment of electronic components | Whonchee Lee | 2002-10-01 |
| 6455923 | Apparatus and methods for providing substrate structures having metallic layers for microelectronics devices | Walter L. Moden | 2002-09-24 |
| 6455354 | Method of fabricating tape attachment chip-on-board assemblies | — | 2002-09-24 |
| 6452271 | Interconnect component for a semiconductor die including a ruthenium layer and a method for its fabrication | Li Li | 2002-09-17 |