Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Automated method of attaching flip chip devices to a substrate

Automated method of attaching flip chip devices to a substrate

US Patent 6537400 · Granted Mar 25, 2003

Estimated economic value: $1,989,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Proximity coupling interconnect packaging systems and methods2022
Proximity coupling interconnect packaging systems and methods2019
Proximity coupling of interconnect packaging systems and methods2018
Proximity coupling of interconnect packaging systems and methods2017
Techniques for packaging multiple device components2017
Devices and method for handling microelectronics assemblies2015
Packaged microdevices and methods for manufacturing packaged microdevices2015
Semiconductor device structures and electronic devices including hybrid conducti2014
Semiconductor device including one or more stiffening elements2014
Techniques for packaging multiple device components2014
Methods of fabrication of package assemblies for optically interactive electroni2014
Advanced detection of memory device removal, and methods, devices and connectors2013