Issued Patents All Time
Showing 26–36 of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6521287 | Method for manufacturing improved stencil/screen | Tongbi Jiang, Chad A. Cobbley | 2003-02-18 |
| 6472901 | Method for in-line testing of flip-chip semiconductor assemblies | Chad A. Cobbley, Bret K. Street, Tongbi Jiang | 2002-10-29 |
| 6440777 | Method of depositing a thermoplastic polymer in semiconductor fabrication | Chad A. Cobbley, Tongbi Jiang | 2002-08-27 |
| 6369602 | Method for in-line testing of flip-chip semiconductor assemblies | Chad A. Cobbley, Bret K. Street, Tongbi Jiang | 2002-04-09 |
| 6368897 | Method for manufactoring and using stencil/screen | Tongbi Jiang, Chad A. Cobbley | 2002-04-09 |
| 6329832 | Method for in-line testing of flip-chip semiconductor assemblies | Chad A. Cobbley, Bret K. Street, Tongbi Jiang | 2001-12-11 |
| 6281044 | Method and system for fabricating semiconductor components | — | 2001-08-28 |
| 6238223 | Method of depositing a thermoplastic polymer in semiconductor fabrication | Chad A. Cobbley, Tongbi Jiang | 2001-05-29 |
| 6084311 | Method and apparatus for reducing resin bleed during the formation of a semiconductor device | Tongbi Jiang, Ed A. Schrock | 2000-07-04 |
| 6025212 | Method for attaching semiconductor dice to lead-on-chip leadframes | Scott Clifford | 2000-02-15 |
| 6012502 | Apparatus for attaching adhesive tape to lead-on-chip leadframes | Scott Clifford | 2000-01-11 |