Issued Patents All Time
Showing 76–85 of 85 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6692978 | Methods for marking a bare semiconductor die | William Tandy | 2004-02-17 |
| 6548764 | Semiconductor packages and methods for making the same | Casey Prindiville, Tongbi Jiang | 2003-04-15 |
| 6545498 | Method for in-line testing of flip-chip semiconductor assemblies | Chad A. Cobbley, John VanNortwick, Tongbi Jiang | 2003-04-08 |
| 6523254 | Method for gate blocking x-outs during a molding process | Casey Prindiville, Cary J. Baerlocher | 2003-02-25 |
| 6524881 | Method and apparatus for marking a bare semiconductor die | William Tandy | 2003-02-25 |
| 6503781 | Molded ball grid array | William R. Stephenson, Todd O. Bolken | 2003-01-07 |
| 6472901 | Method for in-line testing of flip-chip semiconductor assemblies | Chad A. Cobbley, John VanNortwick, Tongbi Jiang | 2002-10-29 |
| 6400574 | Molded ball grid array | William R. Stephenson, Todd O. Bolken | 2002-06-04 |
| 6369602 | Method for in-line testing of flip-chip semiconductor assemblies | Chad A. Cobbley, John VanNortwick, Tongbi Jiang | 2002-04-09 |
| 6329832 | Method for in-line testing of flip-chip semiconductor assemblies | Chad A. Cobbley, John VanNortwick, Tongbi Jiang | 2001-12-11 |