Issued Patents All Time
Showing 26–49 of 49 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9741683 | Device packaging facility and method, and device processing apparatus utilizing phthalate | Jian Zhang, Joshua Pinnolis | 2017-08-22 |
| 9543274 | Semiconductor device packages with improved thermal management and related methods | Steven K. Groothuis, Jian Li | 2017-01-10 |
| 9472531 | Device packaging facility and method, and device processing apparatus utilizing phthalate | Jian Zhang, Joshua Pinnolis | 2016-10-18 |
| 9269646 | Semiconductor die assemblies with enhanced thermal management and semiconductor devices including same | Xiao Li, Jian Li | 2016-02-23 |
| 9269700 | Stacked semiconductor die assemblies with improved thermal performance and associated systems and methods | Michel Koopmans, David R. Hembree | 2016-02-23 |
| 9184105 | Semiconductor device packages including thermally insulating materials and methods of making and using such semiconductor packages | Steven K. Groothuis, Jian Li | 2015-11-10 |
| 9157014 | Adhesives including a filler material and related methods | Xiao Li | 2015-10-13 |
| 9153520 | Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods | Steven K. Groothuis, Jian Li, Haojun Zhang, Paul A. Silvestri, Xiao Li +3 more | 2015-10-06 |
| 9128382 | Plasma mediated ashing processes that include formation of a protective layer before and/or during the plasma mediated ashing process | Ivan L. Berry, III, Orlando Escorcia, Keping Han, Jianan Hou, Carlo Waldfried | 2015-09-08 |
| 9070656 | Underfill-accommodating heat spreaders and related semiconductor device assemblies and methods | Andy E. Hooper, Xiao Li | 2015-06-30 |
| 8816494 | Semiconductor device packages including thermally insulating materials and methods of making and using such semiconductor packages | Steven K. Groothuis, Jian Li | 2014-08-26 |
| 8492242 | Dry flux bonding device and method | Owen R. Fay, Xiao Li, Josh D. Woodland, Jaspreet S. Gandhi, Te-Sung Wu | 2013-07-23 |
| 8072055 | High density stacked die assemblies, structures incorporated therein and methods of fabricating the assemblies | David J. Corisis, Tongbi Jiang | 2011-12-06 |
| 7851266 | Microelectronic device wafers including an in-situ molded adhesive, molds for in-situ molding adhesives on microelectronic device wafers, and methods of molding adhesives on microelectronic device wafers | Tongbi Jiang | 2010-12-14 |
| 7696011 | Methods for applying front side and edge protection material to electronic devices at the wafer level, devices made by the methods, and systems including the devices | Tongbi Jiang | 2010-04-13 |
| 7663381 | Electrical condition monitoring method for polymers | Kenneth S. Watkins, Jr., Shelby J. Morris, Daniel D. Masakowski, Ching-Ping Wong | 2010-02-16 |
| 7592691 | High density stacked die assemblies, structures incorporated therein and methods of fabricating the assemblies | David J. Corisis, Tongbi Jiang | 2009-09-22 |
| 7417305 | Electronic devices at the wafer level having front side and edge protection material and systems including the devices | Tongbi Jiang | 2008-08-26 |
| 7414416 | Electrical condition monitoring method for polymers | Kenneth S. Watkins, Jr., Shelby J. Morris, Daniel D. Masakowski, Ching-Ping Wong | 2008-08-19 |
| 7411297 | Microfeature devices and methods for manufacturing microfeature devices | Tongbi Jiang | 2008-08-12 |
| 7253089 | Microfeature devices and methods for manufacturing microfeature devices | Tongbi Jiang | 2007-08-07 |
| 7199464 | Semiconductor device structures including protective layers formed from healable materials | Tongbi Jiang, S. Hinkle | 2007-04-03 |
| 7199037 | Microfeature devices and methods for manufacturing microfeature devices | Tongbi Jiang | 2007-04-03 |
| 6885108 | Protective layers formed on semiconductor device components so as to reduce or eliminate the occurrence of delamination thereof and cracking therein | Tongbi Jiang, S. Hinkle | 2005-04-26 |