Issued Patents All Time
Showing 25 most recent of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12392040 | Metal body having magnesium fluoride region formed therefrom | Bryan C. Hendrix | 2025-08-19 |
| 12322634 | Electrostatic chuck prepared by additive manufacturing, and related methods and structures | Chandra Venkatraman, Scott Sirignano, Yan Liu, Subhash Guddati, Thines Kumar Perumal +2 more | 2025-06-03 |
| 12270104 | Substrate with fluorinated yttrium coatings, and methods of preparing and using the substrates | Nilesh Gunda, Jayasri Narayanamoorthy | 2025-04-08 |
| 12101920 | Conductive polymeric layers for charge dissipation | Yuxuan Liu, Zhifeng Li, Yan Liu, Chandra Venkatraman, Pushkara R. Varanasi | 2024-09-24 |
| 12084778 | Coatings for enhancement of properties and performance of substrate articles and apparatus | Bryan C. Hendrix, David Walter Peters, Weimin Li, Richard A. Cooke, Nilesh Gunda +1 more | 2024-09-10 |
| 12031212 | Yttrium fluoride films and methods of preparing and using yttrium fluoride films | Stephen Longo, Parul Tyagi | 2024-07-09 |
| 12018382 | Coatings for enhancement of properties and performance of substrate articles and apparatus | Bryan C. Hendrix, David Walter Peters, Weimin Li, Richard A. Cooke, Nilesh Gunda +1 more | 2024-06-25 |
| 11772127 | Methods for applying a blanket polymer coating to a substrate | Yan Liu, Yuxuan Liu, Chandra Venkatraman | 2023-10-03 |
| 11764037 | Surface coating for chamber components used in plasma systems | — | 2023-09-19 |
| 11713504 | Chemical resistant multi-layer coatings applied by atomic layer deposition | I-Kuan Lin, Chandrasekaran Venkatraman | 2023-08-01 |
| 11390943 | Chemical resistant multi-layer coatings applied by atomic layer deposition | I-Kuan Lin, Chandrasekaran Venkatraman | 2022-07-19 |
| 10882774 | Coatings for glass-shaping molds and molds comprising the same | Troy Scoggins, Rex Gerald Sheppard | 2021-01-05 |
| 10770330 | Wafer contact surface protrusion profile with improved particle performance | John Michael Glasko, I-Kuan Lin | 2020-09-08 |
| 10497598 | Electrostatic chuck and method of making same | Richard A. Cooke, Wolfram Neff, Jakub Rybczynski, Michael J. Hanagan, Wade A. Krull | 2019-12-03 |
| 9128382 | Plasma mediated ashing processes that include formation of a protective layer before and/or during the plasma mediated ashing process | Ivan L. Berry, III, Orlando Escorcia, Keping Han, Jianan Hou, Shijian Luo | 2015-09-08 |
| 8580076 | Plasma apparatus, gas distribution assembly for a plasma apparatus and processes therewith | Alan F. Becknell, Thomas Buckley, David Ferris, Richard E. Pingree, Jr., Palanikumaran Sakthivel +1 more | 2013-11-12 |
| 8338315 | Processes for curing silicon based low-k dielectric materials | Darren L. Moore, Ganesh Karuppur Rajagopalan | 2012-12-25 |
| 7709814 | Apparatus and process for treating dielectric materials | Christopher Garmer, Orlando Escorcia, Ivan L. Berry, III, Palani Sakthivel, Alan C. Janos | 2010-05-04 |
| 7704872 | Ultraviolet assisted pore sealing of porous low k dielectric films | Orlando Escorcia, Ivan L. Berry, III | 2010-04-27 |
| 7678682 | Ultraviolet assisted pore sealing of porous low k dielectric films | Orlando Escorcia, Ivan L. Berry, III | 2010-03-16 |
| 7629272 | Ultraviolet assisted porogen removal and/or curing processes for forming porous low k dielectrics | Qingyuan Han, Orlando Escorcia, Ivan L. Berry, III | 2009-12-08 |
| 7078161 | Plasma ashing process for removing photoresist and residues during ferroelectric device fabrication | Qingyuan Han, Orlando Escorcia, Ebrahim Andideh | 2006-07-18 |
| 7011868 | Fluorine-free plasma curing process for porous low-k materials | Qingyuan Han, Orlando Escorcia, Ralph Albano, Ivan L. Berry, III, Atsushi Shiota | 2006-03-14 |
| 6951823 | Plasma ashing process | Orlando Escorcia, Qingyuan Han, Thomas Buckley, Palani Sakthivel | 2005-10-04 |
| 6913796 | Plasma curing process for porous low-k materials | Ralph Albano, Cory Bargeron, Ivan L. Berry, III, Jeff Bremmer, Phil Dembowski +3 more | 2005-07-05 |