Issued Patents All Time
Showing 26–33 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7637412 | Apparatus and method for depositing and reflowing solder paste on a microelectronic workpiece | — | 2009-12-29 |
| 7347348 | Apparatus and method for depositing and reflowing solder paste on a microelectronic workpiece | — | 2008-03-25 |
| 6943094 | Method for attaching semiconductor components to a substrate using component attach system having radiation exposure assembly | — | 2005-09-13 |
| 6911624 | Component installation, removal, and replacement apparatus and method | — | 2005-06-28 |
| 6845901 | Apparatus and method for depositing and reflowing solder paste on a microelectronic workpiece | — | 2005-01-25 |
| 6847105 | Bumping technology in stacked die configurations | — | 2005-01-25 |
| 6706557 | Method of fabricating stacked die configurations utilizing redistribution bond pads | — | 2004-03-16 |
| 6589809 | Method for attaching semiconductor components to a substrate using local UV curing of dicing tape | — | 2003-07-08 |