Issued Patents All Time
Showing 26–42 of 42 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10461061 | Apparatuses and methods for semiconductor die heat dissipation | Xiao Li, Anilkumar Chandolu | 2019-10-29 |
| 10424553 | Semiconductor devices with underfill control features, and associated systems and methods | Suresh Yeruva, Kyle K. Kirby, Owen R. Fay | 2019-09-24 |
| 10297577 | Semiconductor device assembly with heat transfer structure formed from semiconductor material | Jaspreet S. Gandhi, James M. Derderian | 2019-05-21 |
| 10163755 | Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths | Xiao Li, Steven K. Groothuis, Jian Li, Jaspreet S. Gandhi, James M. Derderian +1 more | 2018-12-25 |
| 10163830 | Bonding pads with thermal pathways | Jaspreet S. Gandhi, James M. Derderian, Jian Li | 2018-12-25 |
| 10079333 | Solid-state radiation transducer devices having flip-chip mounted solid-state radiation transducers and associated systems and methods | — | 2018-09-18 |
| 9837396 | Stacked semiconductor die assemblies with high efficiency thermal paths and associated methods | Xiao Li, Steven K. Groothuis, Jian Li, Jaspreet S. Gandhi, James M. Derderian +1 more | 2017-12-05 |
| 9780052 | Collars for under-bump metal structures and associated systems and methods | Giorgio Mariottini, Wayne H. Huang, Anilkumar Chandolu, Mark Bossler | 2017-10-03 |
| 9768149 | Semiconductor device assembly with heat transfer structure formed from semiconductor material | Jaspreet S. Gandhi, James M. Derderian | 2017-09-19 |
| 9691746 | Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths | Xiao Li, Steven K. Groothuis, Jian Li, Jaspreet S. Gandhi, James M. Derderian +1 more | 2017-06-27 |
| 9647167 | Solid-state radiation transducer devices having flip-chip mounted solid-state radiation transducers and associated systems and methods | — | 2017-05-09 |
| 9515002 | Bonding pads with thermal pathways | Jaspreet S. Gandhi, James M. Derderian, Jian Li | 2016-12-06 |
| 9443744 | Stacked semiconductor die assemblies with high efficiency thermal paths and associated methods | Xiao Li, Steven K. Groothuis, Jian Li, Jaspreet S. Gandhi, James M. Derderian +1 more | 2016-09-13 |
| 9397078 | Semiconductor device assembly with underfill containment cavity | Anilkumar Chandolu, Wayne H. Huang | 2016-07-19 |
| 9337119 | Stacked semiconductor die assemblies with high efficiency thermal paths and associated systems | Xiao Li, Jaspreet S. Gandhi | 2016-05-10 |
| 9039474 | Magnetically adjusting color-converting materials within a matrix and associated devices, systems, and methods | Tim J. Corbett, Xiao Li | 2015-05-26 |
| 8952402 | Solid-state radiation transducer devices having flip-chip mounted solid-state radiation transducers and associated systems and methods | — | 2015-02-10 |