Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Chip modules employing conductive pillars to couple a passive component device to conductive traces in a metallization structure to form a passive component

Chip modules employing conductive pillars to couple a passive component device to conductive traces in a metallization structure to form a passive component

US Patent 11728293 · Granted Aug 15, 2023

Estimated economic value: $7,580,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Integrated passive devices2025
Integrated passive devices2025
Integrated passive devices2025
Integrated passive devices2025
Integrated passive devices2025
Compact hybrid acoustic wave filter structure2025
Integrated device and integrated passive device comprising magnetic material2025
Package comprising an acoustic device and a polymer cap layer2025
Wideband filter with resonators and inductors2025
Radio frequency oscillator with ceramic resonator and surface-mounted integrated2025
Thin film resistor (TFR) device structure for high performance radio frequency (2024
Package comprising substrate with coupling element for integrated devices2024