{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Apparatuses and methods for semiconductor die heat dissipation", "item": "https://www.patentleaderboard.com/patent/10541229"}]}
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Home › Apparatuses and methods for semiconductor die heat dissipation

Apparatuses and methods for semiconductor die heat dissipation

US Patent 10541229 · Granted Jan 21, 2020

Estimated economic value: $26,345,000 ⓘ

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