Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8753926 | Electronic packaging with a variable thickness mold cap | Christopher J. Healy, Gopal C. Jha | 2014-06-17 |
| 8546921 | Hybrid multilayer substrate | Gopal C. Jha, Christopher J. Healy | 2013-10-01 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8753926 | Electronic packaging with a variable thickness mold cap | Christopher J. Healy, Gopal C. Jha | 2014-06-17 |
| 8546921 | Hybrid multilayer substrate | Gopal C. Jha, Christopher J. Healy | 2013-10-01 |