BR

Brian Roggeman

QU Qualcomm: 1 patents #7,512 of 12,104Top 65%
Overall (All Time): #2,885,787 of 4,157,543Top 70%
1
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
9947642 Package-on-Package (PoP) device comprising a gap controller between integrated circuit (IC) packages Rajneesh Kumar, Chin-Kwan Kim 2018-04-17