Issued Patents All Time
Showing 26–39 of 39 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9601435 | Semiconductor package with embedded components and method of making the same | David Fraser Rae, Rajneesh Kumar, Milind Shah, Omar J. Bchir | 2017-03-21 |
| 9484327 | Package-on-package structure with reduced height | Omar J. Bchir, Milind Shah, Marcus HSU, David Fraser Rae | 2016-11-01 |
| 9379090 | System, apparatus, and method for split die interconnection | Ahmer Syed, Omar J. Bchir, Milind Shah, Ryan David Lane | 2016-06-28 |
| 9370097 | Package substrate with testing pads on fine pitch traces | Kuiwon Kang, Omar J. Bchir | 2016-06-14 |
| 9355963 | Semiconductor package interconnections and method of making the same | Dong Wook Kim, Jae Sik Lee, Hong Bok We, Young Kyu Song, Kyu-Pyung Hwang +1 more | 2016-05-31 |
| 9269610 | Pattern between pattern for low profile substrate | Hong Bok We, Dong Wook Kim, Jae Sik Lee, Kyu-Pyung Hwang, Young Kyu Song | 2016-02-23 |
| 9269681 | Surface finish on trace for a thermal compression flip chip (TCFC) | Houssam Jomaa, Omar J. Bchir, Milind Shah, Manuel Aldrete | 2016-02-23 |
| 9159670 | Ultra fine pitch and spacing interconnects for substrate | Rajneesh Kumar, Omar J. Bchir | 2015-10-13 |
| 9155191 | Substrate comprising inorganic material that lowers the coefficient of thermal expansion (CTE) and reduces warpage | — | 2015-10-06 |
| 8802556 | Barrier layer on bump and non-wettable coating on trace | Omar J. Bchir, Milind Shah, Houssam Jomaa, Manuel Aldrete | 2014-08-12 |
| 8772951 | Ultra fine pitch and spacing interconnects for substrate | Rajneesh Kumar, Omar J. Bchir | 2014-07-08 |
| 8253034 | Printed circuit board and semiconductor package with the same | Byoung Chan Kim, Young-Hwan Shin, Dong Won Kim, Kui Won Kang | 2012-08-28 |
| 8080741 | Printed circuit board | Myung Sam Kang | 2011-12-20 |
| 4212125 | Hook setting fishing rod attachment | — | 1980-07-15 |