Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12243840 | Wirebondable interposer for flip chip packaged integrated circuit die | Edwin Loy, Chihhao Chen | 2025-03-04 |
| 11980992 | Integrated abrasive polishing pads and manufacturing methods | Ashavani Kumar, Ashwin CHOCKALINGAM, Sivapackia Ganapathiappan, Rajeev Bajaj, Boyi Fu +6 more | 2024-05-14 |
| 11471999 | Integrated abrasive polishing pads and manufacturing methods | Ashavani Kumar, Ashwin CHOCKALINGAM, Sivapackia Ganapathiappan, Rajeev Bajaj, Boyi Fu +6 more | 2022-10-18 |
| 10845553 | Multichannel RF feedthroughs | Bernd Huebner, Tengda Du, Yuheng Lee | 2020-11-24 |
| 10140410 | Representing a routing strip in an integrated circuit design using a digit pattern | An-Chi Liu, Xiang Gao, Ming Jin Chen | 2018-11-27 |
| 9900974 | Flex-less multilayer ceramic substrate | Wenhua Ling, Yongsheng Liu, Yuheng Lee | 2018-02-20 |
| 9538637 | Multichannel RF feedthroughs | Bernd Huebner, Tengda Du, Yuheng Lee | 2017-01-03 |
| 9330987 | Hot spot identification, inspection, and review | Steve Lin, Wei FANG, Eric Ma, Zhonghua Dong, Jon Yee Chiang +2 more | 2016-05-03 |
| 7978030 | High-speed interconnects | Yuheng Lee, Jianying Zhou, Christopher R. Cole, Bernd Huebner | 2011-07-12 |
| 7880570 | Feed thru with flipped signal plane using guided vias | Jianying Zhou, Yuheng Lee, Bernd Huebner | 2011-02-01 |
| 7859367 | Non-coplanar high-speed interconnects | Yuheng Lee, Jianying Zhou | 2010-12-28 |
| 7474001 | Method for in-line monitoring of via/contact holes etch process based on test structures in semiconductor wafer manufacturing | Chang-Chun Yeh, Zhong-Wei Chen, Jack Jau | 2009-01-06 |
| 7105436 | Method for in-line monitoring of via/contact holes etch process based on test structures in semiconductor wafer manufacturing | Chang-Chun Yeh, Zhong-Wei Chen, Jack Jau | 2006-09-12 |
| 6815345 | Method for in-line monitoring of via/contact holes etch process based on test structures in semiconductor wafer manufacturing | Chang-Chun Yeh, Zhongwei Chen, Jack Jau | 2004-11-09 |
| 5286692 | Mild hydrocracking catlyst and the process therefor | Yuduo Hou, Quanzhu Peng, Jiduan Liu, Xiaogang Chen | 1994-02-15 |