Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 12243840 | Wirebondable interposer for flip chip packaged integrated circuit die | Edwin Loy, Yan Zhao | 2025-03-04 | |
| 12142008 | Asymmetric camera sensor positioning for enhanced package detection | Jacobi Colton Grillo, Adrian Mircea Proca, William Duran | 2024-11-12 | $95,442,000 |
| 7844187 | Optical communications circuit current management | Craig Schulz, David Chak Wang Hui | 2010-11-30 | $13,201,000 |