Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11443915 | Detection of buried features by backscattered particles | Joe Wang, Chia-Wen Lin, Zhongwei Chen | 2022-09-13 |
| 10274537 | Test device for defect inspection | — | 2019-04-30 |
| 9035674 | Structure and method for determining a defect in integrated circuit manufacturing process | Hong Xiao, Jack Jau | 2015-05-19 |
| 8497475 | Method and apparatus for charged particle beam inspection | Shih-Tsuan Chang | 2013-07-30 |
| 8089297 | Structure and method for determining a defect in integrated circuit manufacturing process | Hong Xiao, Jack Jau | 2012-01-03 |
| 8063363 | Method and apparatus for charged particle beam inspection | Shih-Tsuan Chang | 2011-11-22 |
| 7474001 | Method for in-line monitoring of via/contact holes etch process based on test structures in semiconductor wafer manufacturing | Yan Zhao, Zhong-Wei Chen, Jack Jau | 2009-01-06 |
| 7105436 | Method for in-line monitoring of via/contact holes etch process based on test structures in semiconductor wafer manufacturing | Yan Zhao, Zhong-Wei Chen, Jack Jau | 2006-09-12 |
| 6815345 | Method for in-line monitoring of via/contact holes etch process based on test structures in semiconductor wafer manufacturing | Yan Zhao, Zhongwei Chen, Jack Jau | 2004-11-09 |