Issued Patents All Time
Showing 26–50 of 241 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817379 | Substrate comprising an inductor and a capacitor located in an encapsulation layer | Milind Shah, Periannan Chidambaram | 2023-11-14 |
| 11817365 | Thermal mitigation die using back side etch | Aniket PATIL, Hong Bok We | 2023-11-14 |
| 11791226 | Device on ceramic substrate | Je-Hsiung Lan, Ranadeep Dutta | 2023-10-17 |
| 11769732 | Integrated circuit (IC) with reconstituted die interposer for improved connectivity, and related methods of fabrication | Aniket PATIL | 2023-09-26 |
| 11749746 | Radio frequency front end (RFFE) hetero-integration | Ranadeep Dutta, Je-Hsiung Lan | 2023-09-05 |
| 11689181 | Package comprising stacked filters with a shared substrate cap | Je-Hsiung Lan, Ranadeep Dutta, Milind Shah, Periannan Chidambaram | 2023-06-27 |
| 11670614 | Integrated circuit assembly with hybrid bonding | Milind Shah, Periannan Chidambaram, Abdolreza Langari | 2023-06-06 |
| 11658103 | Capacitor interposer layer (CIL) chiplet design with conformal die edge pattern around bumps | Je-Hsiung Lan, Jinseong Kim | 2023-05-23 |
| 11652101 | Trench capacitor assembly for high capacitance density | Milind Shah, Periannan Chidambaram | 2023-05-16 |
| 11652468 | High performance tunable filter | Je-Hsiung Lan | 2023-05-16 |
| 11652064 | Integrated device with electromagnetic shield | Je-Hsiung Lan, Ranadeep Dutta | 2023-05-16 |
| 11631614 | MIM capacitor with adjustable capacitance via electronic fuses | Jin-Su Ko, Beomsup Kim, Periannan Chidambaram | 2023-04-18 |
| 11626236 | Stacked inductor having a discrete metal-stack pattern | Changhan Hobie Yun, Je-Hsiung Lan, Ranadeep Dutta | 2023-04-11 |
| 11605620 | Three-dimensional (3D) integrated circuit with passive elements formed by hybrid bonding | Je-Hsiung Lan, Ranadeep Dutta | 2023-03-14 |
| 11594804 | Antenna on glass with air cavity structure | Je-Hsiung Lan, Sang-June Park | 2023-02-28 |
| 11515289 | Stacked die integrated with package voltage regulators | Bharani Chava, Stanley Seungchul Song, Abinash ROY | 2022-11-29 |
| 11485114 | Electronic device with coating for protection of window | Sungho AHN | 2022-11-01 |
| 11444068 | Three-dimensional (3D) integrated circuit device having a backside power delivery network | Stanley Seungchul Song, Periannan Chidambaram, Pratyush Kamal | 2022-09-13 |
| 11437379 | Field-effect transistors (FET) circuits employing topside and backside contacts for topside and backside routing of FET power and logic signals, and related complementary metal oxide semiconductor (CMOS) circuits | Stanley Seungchul Song, Deepak Sharma, Bharani Chava, Hyeokjin Lim, Peijie Feng +6 more | 2022-09-06 |
| 11437367 | Heterogeneous integrated wideband high electron mobility transistor power amplifier with a single-crystal acoustic resonator/filter | Je-Hsiung Lan, Ranadeep Dutta | 2022-09-06 |
| 11417637 | Stacked decoupling capacitors with integration in a substrate | Milind Shah, Periannan Chidambaram | 2022-08-16 |
| 11404345 | Advanced integrated passive device (IPD) with thin-film heat spreader (TF-HS) layer for high power handling filters in transmit (TX) path | Je-Hsiung Lan, Ranadeep Dutta | 2022-08-02 |
| 11394360 | Resonator device | Je-Hsiung Lan, Ranadeep Dutta | 2022-07-19 |
| 11393789 | Stacked circuits of III-V devices over silicon with high quality integrated passives with hybrid bonding | Je-Hsiung Lan, Ranadeep Dutta | 2022-07-19 |
| 11380678 | Metamorphic high electron mobility transistor-heterojunction bipolar transistor integration | Ranadeep Dutta, Je-Hsiung Lan | 2022-07-05 |