| 10498307 |
Integrated device comprising a capacitor and inductor structure comprising a shared interconnect for a capacitor and an inductor |
Mario Francisco Velez, Niranjan Sunil Mudakatte, Changhan Hobie Yun, David Francis Berdy, Shiqun Gu +1 more |
2019-12-03 |
| 10490621 |
Close proximity tunable inductive elements |
Paragkumar Ajaybhai Thadesar, Mario Francisco Velez, Changhan Hobie Yun, Francesco Carrara, Xiaoju YU +1 more |
2019-11-26 |
| 10490348 |
Two-dimensional structure to form an embedded three-dimensional structure |
Mario Francisco Velez, Daeik Daniel Kim, Niranjan Sunil Mudakatte, David Francis Berdy, Changhan Hobie Yun +3 more |
2019-11-26 |
| 10433425 |
Three-dimensional high quality passive structure with conductive pillar technology |
Kai Liu, Changhan Hobie Yun, Mario Francisco Velez |
2019-10-01 |
| 10361149 |
Land grid array (LGA) packaging of passive-on-glass (POG) structure |
Chengjie Zuo, Mario Francisco Velez, Changhan Hobie Yun, David Francis Berdy, Daeik Daniel Kim |
2019-07-23 |
| 10354795 |
Varying thickness inductor |
Daeik Daniel Kim, Chengjie Zuo, Changhan Hobie Yun, Mario Francisco Velez, Robert Paul Mikulka +2 more |
2019-07-16 |
| 10332911 |
Integrated circuits (ICs) on a glass substrate |
Shiqun Gu, Daeik Daniel Kim, Matthew Michael Nowak, Changhan Hobie Yun, Je-Hsiung Lan +1 more |
2019-06-25 |
| 10332671 |
Solenoid inductor |
Mario Francisco Velez, Niranjan Sunil Mudakatte, Changhan Hobie Yun, Daeik Daniel Kim, David Francis Berdy +2 more |
2019-06-25 |
| 10325855 |
Backside drill embedded die substrate |
Daeik Daniel Kim, Jie Fu, Changhan Hobie Yun, Chin-Kwan Kim, Manuel Aldrete +2 more |
2019-06-18 |
| 10319694 |
Semiconductor assembly and method of making same |
Daniel Daeik Kim, Jie Fu, Manuel Aldrete, Changhan Hobie Yun, David Francis Berdy +2 more |
2019-06-11 |
| 10292269 |
Inductor with metal-insulator-metal (MIM) capacitor |
Niranjan Sunil Mudakatte, Changhan Hobie Yun, Xiaoju YU, Nosun PARK, Mario Francisco Velez |
2019-05-14 |
| 10290414 |
Substrate comprising an embedded inductor and a thin film magnetic core |
Changhan Hobie Yun, Mario Francisco Velez, Chengjie Zuo, Daeik Daniel Kim, David Francis Berdy +3 more |
2019-05-14 |
| 10283257 |
Skewed co-spiral inductor structure |
Daeik Daniel Kim, David Francis Berdy, Chengjie Zuo, Changhan Hobie Yun |
2019-05-07 |
| 10249580 |
Stacked substrate inductor |
Daeik Daniel Kim, Changhan Hobie Yun, David Francis Berdy, Chengjie Zuo, Mario Francisco Velez |
2019-04-02 |
| 10242957 |
Compartment shielding in flip-chip (FC) module |
Daeik Daniel Kim, Changhan Hobie Yun, Mario Francisco Velez, David Francis Berdy, Chengjie Zuo +1 more |
2019-03-26 |
| 10187031 |
Tunable matching network |
Yunfei Ma, Chengjie Zuo, David Francis Berdy, Daeik Daniel Kim, Changhan Hobie Yun +4 more |
2019-01-22 |
| 10171112 |
RF multiplexer with integrated directional couplers |
Yunfei Ma, Chengjie Zuo, David Francis Berdy, Daeik Daniel Kim, Changhan Hobie Yun +4 more |
2019-01-01 |
| 10163771 |
Interposer device including at least one transistor and at least one through-substrate via |
Chengjie Zuo, Changhan Hobie Yun, David Francis Berdy, Niranjan Sunil Mudakatte, Mario Francisco Velez +1 more |
2018-12-25 |
| 10154591 |
Passive device assembly for accurate ground plane control |
Chengjie Zuo, David Francis Berdy, Daeik Daniel Kim, Changhan Hobie Yun, Mario Francisco Velez |
2018-12-11 |
| 10141353 |
Passive components implemented on a plurality of stacked insulators |
Changhan Hobie Yun, Daeik Daniel Kim, Mario Francisco Velez, Chengjie Zuo, David Francis Berdy |
2018-11-27 |
| 10141908 |
Multi-density MIM capacitor for improved passive on glass (POG) multiplexer performance |
Niranjan Sunil Mudakatte, David Francis Berdy, Changhan Hobie Yun, Chengjie Zuo, Shiqun Gu +1 more |
2018-11-27 |
| 10115671 |
Incorporation of passives and fine pitch through via for package on package |
Ravindra V. Shenoy, Kwan-Yu Lai, Philip Jason Stephanou, Mario Francisco Velez, Evgeni Gousev |
2018-10-30 |
| 10116285 |
Integration of a replica circuit and a transformer above a dielectric substrate |
Je-Hsiung Lan, Chi Shun Lo, Mario Francisco Velez, John H. Hong |
2018-10-30 |
| 10103703 |
Double-sided circuit |
Changhan Hobie Yun, David Francis Berdy, Chengjie Zuo, Daeik Daniel Kim, Mario Francisco Velez +2 more |
2018-10-16 |
| 10103135 |
Backside ground plane for integrated circuit |
Chengjie Zuo, David Francis Berdy, Changhan Hobie Yun, Niranjan Sunil Mudakatte, Mario Francisco Velez +1 more |
2018-10-16 |
