Issued Patents All Time
Showing 51–75 of 241 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11342246 | Multi-terminal integrated passive devices embedded on die and a method for fabricating the multi-terminal integrated passive devices | Aniket PATIL, Hong Bok We | 2022-05-24 |
| 11336251 | Device with 3D inductor and magnetic core in substrate | Je-Hsiung Lan, Ranadeep Dutta | 2022-05-17 |
| 11320847 | Voltage regulation integrated circuit (IC) with circuit components in an integrated three-dimensional (3D) inductor core and related methods of fabrication | Ravindra V. Shenoy, Milind Shah, Evgeni Gousev, Periannan Chidambaram | 2022-05-03 |
| 11310911 | Three-dimensional (3D) integrated circuit (IC) integration of an embedded chip and a preformed metal routing structure | Stanley Seungchul Song, Periannan Chidambaram | 2022-04-19 |
| 11296024 | Nested interconnect structure in concentric arrangement for improved package architecture | Aniket PATIL, Hong Bok We | 2022-04-05 |
| 11296670 | Impedance matching transceiver | Milind Shah, Periannan Chidambaram | 2022-04-05 |
| 11211290 | MIM capacitor with adjustable capacitance via electronic fuses | Jin-Su Ko, Beomsup Kim, Periannan Chidambaram | 2021-12-28 |
| 11201127 | Device comprising contact to contact coupling of packages | Milind Shah, Periannan Chidambaram | 2021-12-14 |
| 11189686 | Integrated device coupled to a capacitor structure comprising a trench capacitor | Milind Shah, Periannan Chidambaram | 2021-11-30 |
| 11158590 | Capacitor interposer layer (CIL) in a die-to-wafer three-dimensional (3D) integrated circuit (IC) (3DIC) | Je-Hsiung Lan, Jinseong Kim, Periannan Chidambaram | 2021-10-26 |
| 11152272 | Die-to-wafer hybrid bonding with forming glass | Je-Hsiung Lan, Ranadeep Dutta | 2021-10-19 |
| 11145768 | Trench capacitor component with reduced equivalent series resistance and equivalent series inductance | Periannan Chidambaram | 2021-10-12 |
| 11121699 | Wideband filter with resonators and inductors | Kai Liu, Rui Tang, Changhan Hobie Yun, Mario Francisco Velez | 2021-09-14 |
| 11101228 | Integrated circuit package with a magnetic core | Milind Shah, Periannan Chidambaram | 2021-08-24 |
| 11073869 | Electronic device with coating for protection of window | Sungho AHN | 2021-07-27 |
| 11024454 | High performance inductors | Daeik Daniel Kim, Mario Francisco Velez, Changhan Hobie Yun, Niranjan Sunil Mudakatte, Chengjie Zuo +1 more | 2021-06-01 |
| 10944379 | Hybrid passive-on-glass (POG) acoustic filter | David Francis Berdy, Changhan Hobie Yun, Shiqun Gu, Niranjan Sunil Mudakatte, Mario Francisco Velez +1 more | 2021-03-09 |
| 10903240 | Integrated circuits (ICs) on a glass substrate | Shiqun Gu, Daniel Daeik Kim, Matthew Michael Nowak, Changhan Hobie Yun, Je-Hsiung Lan +1 more | 2021-01-26 |
| 10840884 | Bulk acoustic wave (BAW) and passive-on-glass (POG) filter co-integration | Stanley Seungchul Song, Periannan Chidambaram | 2020-11-17 |
| 10693432 | Solenoid structure with conductive pillar technology | Nosun PARK, Changhan Hobie Yun, Niranjan Sunil Mudakatte, Xiaoju YU, Wei-Chuan Chen | 2020-06-23 |
| 10614942 | Inductors formed with through glass vias | Changhan Hobie Yun, Mario Francisco Velez, Nosun PARK, Wei-Chuan Chen, Niranjan Sunil Mudakatte +2 more | 2020-04-07 |
| 10607980 | Passive-on-glass (POG) device and method | Je-Hsiung Lan, Niranjan Sunil Mudakatte, Changhan Hobie Yun, Daeik Daniel Kim, Chengjie Zuo +2 more | 2020-03-31 |
| 10582609 | Integration of through glass via (TGV) filter and acoustic filter | Changhan Hobie Yun, Xiaoju YU, Mario Francisco Velez, Wei-Chuan Chen, Niranjan Sunil Mudakatte +7 more | 2020-03-03 |
| 10553671 | 3D pillar inductor | Chengjie Zuo, Daeik Daniel Kim, Changhan Hobie Yun, Mario Francisco Velez | 2020-02-04 |
| 10523253 | Glass substrate including passive-on-glass device and semiconductor die | Changhan Hobie Yun, Chengjie Zuo, Mario Francisco Velez, Niranjan Sunil Mudakatte, Shiqun Gu +1 more | 2019-12-31 |