Issued Patents All Time
Showing 25 most recent of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10490348 | Two-dimensional structure to form an embedded three-dimensional structure | Mario Francisco Velez, Daeik Daniel Kim, Niranjan Sunil Mudakatte, David Francis Berdy, Changhan Hobie Yun +3 more | 2019-11-26 |
| 10354795 | Varying thickness inductor | Daeik Daniel Kim, Chengjie Zuo, Changhan Hobie Yun, Mario Francisco Velez, Xiangdong Zhang +2 more | 2019-07-16 |
| 10290414 | Substrate comprising an embedded inductor and a thin film magnetic core | Changhan Hobie Yun, Mario Francisco Velez, Chengjie Zuo, Daeik Daniel Kim, David Francis Berdy +3 more | 2019-05-14 |
| 10187031 | Tunable matching network | Yunfei Ma, Chengjie Zuo, David Francis Berdy, Daeik Daniel Kim, Changhan Hobie Yun +4 more | 2019-01-22 |
| 10171112 | RF multiplexer with integrated directional couplers | Yunfei Ma, Chengjie Zuo, David Francis Berdy, Daeik Daniel Kim, Changhan Hobie Yun +4 more | 2019-01-01 |
| 10103703 | Double-sided circuit | Changhan Hobie Yun, David Francis Berdy, Chengjie Zuo, Daeik Daniel Kim, Jonghae Kim +2 more | 2018-10-16 |
| 10074625 | Wafer level package (WLP) ball support using cavity structure | Mario Francisco Velez, David Francis Berdy, Changhan Hobie Yun, Jonghae Kim, Chengjie Zuo +3 more | 2018-09-11 |
| 10069474 | Encapsulation of acoustic resonator devices | Changhan Hobie Yun, Chengjie Zuo, Daeik Daniel Kim, Mario Francisco Velez, Niranjan Sunil Mudakatte +4 more | 2018-09-04 |
| 9966426 | Augmented capacitor structure for high quality (Q)-factor radio frequency (RF) applications | Niranjan Sunil Mudakatte, Daeik Daniel Kim, David Francis Berdy, Changhan Hobie Yun, Je-Hsiung Lan +3 more | 2018-05-08 |
| 9935166 | Capacitor with a dielectric between a via and a plate of the capacitor | Je-Hsiung Lan, Chengjie Zuo, Changhan Hobie Yun, David Francis Berdy, Daeik Daniel Kim +2 more | 2018-04-03 |
| 9906318 | Frequency multiplexer | Chengjie Zuo, Daeik Daniel Kim, David Francis Berdy, Changhan Hobie Yun, Je-Hsiung Lan +5 more | 2018-02-27 |
| 9876513 | LC filter layer stacking by layer transfer to make 3D multiplexer structures | Changhan Hobie Yun, David Francis Berdy, Chengjie Zuo, Daeik Daniel Kim, Mario Francisco Velez +1 more | 2018-01-23 |
| 9813043 | Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) and related components and methods | Chengjie Zuo, Daeik Daniel Kim, Je-Hsiung Lan, Jonghae Kim, Mario Francisco Velez +5 more | 2017-11-07 |
| 9666362 | Superposed structure 3D orthogonal through substrate inductor | David Francis Berdy, Chengjie Zuo, Daeik Daniel Kim, Changhan Hobie Yun, Mario Francisco Velez +1 more | 2017-05-30 |
| 9660110 | Varactor device with backside contact | Daeik Daniel Kim, Jonghae Kim, Chengjie Zuo, Sang-June Park, Changhan Hobie Yun +3 more | 2017-05-23 |
| 9634640 | Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) and related components and methods | Chengjie Zuo, Daeik Daniel Kim, Je-Hsiung Lan, Jonghae Kim, Mario Francisco Velez +5 more | 2017-04-25 |
| 9468098 | Face-up substrate integration with solder ball connection in semiconductor package | Daeik Daniel Kim, Jonghae Kim, Chengjie Zuo, Changhan Hobie Yun, Mario Francisco Velez | 2016-10-11 |
| 9449753 | Varying thickness inductor | Daeik Daniel Kim, Chengjie Zuo, Changhan Hobie Yun, Mario Francisco Velez, Xiangdong Zhang +2 more | 2016-09-20 |
| 9425761 | High pass filters and low pass filters using through glass via technology | Chengjie Zuo, Jonghae Kim, Changhan Hobie Yun, Daeik Daniel Kim, Mario Francisco Velez +2 more | 2016-08-23 |
| 9343399 | Thick conductive stack plating process with fine critical dimension feature size for compact passive on glass technology | Je-Hsiung Lan, Chengjie Zuo, Changhan Hobie Yun, Jonghae Kim, Daeik Daniel Kim +2 more | 2016-05-17 |
| 9343403 | Stress mitigation structure for wafer warpage reduction | Je-Hsiung Lan, David Francis Berdy, Chengjie Zuo, Daeik Daniel Kim, Changhan Hobie Yun +3 more | 2016-05-17 |
| 9331666 | Composite dilation mode resonators | Chengjie Zuo, Jonghae Kim, Changhan Hobie Yun, Sang-June Park, Philip Jason Stephanou +4 more | 2016-05-03 |
| 9275786 | Superposed structure 3D orthogonal through substrate inductor | David Francis Berdy, Chengjie Zuo, Daeik Daniel Kim, Changhan Hobie Yun, Mario Francisco Velez +1 more | 2016-03-01 |
| 9264013 | Systems for reducing magnetic coupling in integrated circuits (ICS), and related components and methods | Chengjie Zuo, Jonghae Kim, Daeik Daniel Kim, Mario Francisco Velez, Changhan Hobie Yun +2 more | 2016-02-16 |
| 9202789 | Die package comprising die-to-wire connector and a wire-to-die connector configured to couple to a die package | Daeik Daniel Kim, Mario Francisco Velez, Jonghae Kim, Matthew Michael Nowak, Chengjie Zuo +2 more | 2015-12-01 |