Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11626551 | Bonding ultra-dense bump arrays using alignment bumps | Nachiket R. Raravikar, Kwong-Hin Henry Choy, Tigran Nshanian, Paul Scott Martin | 2023-04-11 |
| 7687810 | Robust LED structure for substrate lift-off | Qingwei Mo | 2010-03-30 |