Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11626551 | Bonding ultra-dense bump arrays using alignment bumps | Nachiket R. Raravikar, Arnold Daguio, Kwong-Hin Henry Choy, Paul Scott Martin | 2023-04-11 |
| 11152539 | Reducing or eliminating nanopipe defects in III-nitride structures | Isaac Wildeson, Patrick N. Grillot, Parijat Deb | 2021-10-19 |
| 10651340 | Reducing or eliminating nanopipe defects in III-nitride structures | Patrick N. Grillot, Isaac Wildeson, Parijat Deb | 2020-05-12 |
| 10193015 | Reducing or eliminating nanopipe defects in III-nitride structures | Patrick N. Grillot, Isaac Wildeson, Parijat Deb | 2019-01-29 |
| 9406836 | Reducing or eliminating nanopipe defects in III-nitride structures | Patrick N. Grillot, Isaac Wildeson, Parijan Pramil Deb | 2016-08-02 |