Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9604210 | Controlled fluid delivery in a microelectronic package | James C. Matayabas, Jr., Nirupama Chakrapani | 2017-03-28 |
| 9156973 | Meltprocessed fluoropolymer article and method for melt-processing fluoropolymers | Christopher M. Comeaux, Mathilde Leboeuf | 2015-10-13 |
| 9101931 | Controlled fluid delivery in a microelectronic package | James C. Matayabas, Jr., Nirupama Chakrapani | 2015-08-11 |
| 8592972 | Thermally conductive device with a thermal interface material | Jessica Weninger, Leonel Arana, Lateef Mustapha | 2013-11-26 |
| 8383459 | Methods of processing a thermal interface material | Jessica Weninger, Leonel Arana, Lateef Mustapha | 2013-02-26 |
| 8183697 | Apparatus and methods of forming an interconnect between a workpiece and substrate | Anna M. Prakash, Tommy L. Ashton | 2012-05-22 |
| 8173259 | Methods to fabricate functionally gradient materials and structures formed thereby | Linda A. Shekhawat | 2012-05-08 |
| 8124517 | Method of forming an interconnect joint | Daewoong Suh | 2012-02-28 |
| 8017498 | Multiple die structure and method of forming a connection between first and second dies in same | Gloria Alejandra Camacho-Bragado | 2011-09-13 |
| 7843075 | Apparatus and methods of forming an interconnect between a workpiece and substrate | Anna M. Prakash, Tommy L. Ashton | 2010-11-30 |
| 7727886 | Forming vias using sacrificial material | Omar J. Bchir | 2010-06-01 |
| 7651021 | Microball attachment using self-assembly for substrate bumping | Ravi Kiran Nalla | 2010-01-26 |
| 7611985 | Formation of holes in substrates using dewetting coatings | James C. Matayabas, Jr. | 2009-11-03 |