AB

Andrew Bell

PR Promerus: 52 patents #2 of 140Top 2%
SC Sumitomo Bakelite Co.: 13 patents #5 of 790Top 1%
HE Hercules: 8 patents #43 of 715Top 7%
Merck: 6 patents #1,819 of 9,382Top 20%
BG B. F. Goodrich: 3 patents #166 of 734Top 25%
O( Oerlikon Metco (Us): 2 patents #12 of 59Top 25%
MA Metton America: 2 patents #1 of 7Top 15%
CL Cymetech, L.L.C.: 1 patents #8 of 21Top 40%
PS Penn State: 1 patents #667 of 1,788Top 40%
TA The University Of Akron: 1 patents #250 of 724Top 35%
IT Itt: 1 patents #249 of 721Top 35%
Caltech: 1 patents #2,143 of 4,321Top 50%
EC Eastman Chemical: 1 patents #797 of 1,245Top 65%
Overall (All Time): #23,834 of 4,157,543Top 1%
78
Patents All Time

Issued Patents All Time

Showing 25 most recent of 78 patents

Patent #TitleCo-InventorsDate
11819913 Wear resistant layer Wei Liu, Zhongming Wang 2023-11-21
11292088 Wear resistant coating 2022-04-05
10626216 High glass transition temperature polycarbonates derived from adamantane epoxides Keitaro Seto 2020-04-21
10245562 Pervaporation membranes derived from polycyclo-olefinic block copolymers Oleksandr Burtovyy, Tamami Takigawa 2019-04-02
10227433 Cycloalkylnorbornene monomers, polymers derived therefrom and their use in pervaporation Leah Langsdorf, Oleksandr Burtovyy 2019-03-12
10174171 Nanoporous films derived from polycyclo-olefinic block polymers Oleksandr Burtovyy, Bryan D. Vogt, Changhuai Ye 2019-01-08
9890244 Thermally decomposable polymer compositions incorporating thermally activated base generators W. C. Peter Tsang 2018-02-13
9765200 Polymer composition for microelectronic assembly Christopher Apanius, Leah Langsdorf, W. C. Peter Tsang 2017-09-19
9757818 Thermally decomposable polymer compositions for forming microelectronic assemblies W. C. Peter Tsang, Hongshi Zhen, Keitaro Seto 2017-09-12
9647222 Gate insulator layer for organic electronic devices David Christoph Müller, Toby Cull, Pawel Miskiewicz, Miguel Carrasco-Orozco, Edmund Elce +5 more 2017-05-09
9647213 Interlayer for electronic devices David Christoph Müller, Pawel Miskiewicz, Toby Cull, Piotr Wierzchowiec, Edmund Elce +5 more 2017-05-09
9610549 Polycyclo-olefinic block copolymers Tamami Takigawa 2017-04-04
9583713 Interlayer for electronic devices David Christoph Mueller, Pawel Miskiewicz, Toby Cull, Piotr Wierzchowiec, Edmund Elce +5 more 2017-02-28
9562124 Thermo-oxidatively stable, side chain polyether functionalized polynorbornenes for microelectronic and optoelectronic devices and assemblies thereof Christopher Apanius, Cheryl Burns, Crystal Cyrus, Edmund Elce, Royce Groff +5 more 2017-02-07
9527957 High glass transition temperature photoimageable polycarbonate polymers with pendent polycyclic functional groups W. C. Peter Tsang, Keitaro Seto 2016-12-27
9505948 Thermally decomposable polymer compositions for forming microelectronic assemblies W. C. Peter Tsang, Hongshi Zhen, Keitaro Seto 2016-11-29
9505688 Process for the preparation of high purity norbornene alkanols and derivatives thereof Dane Jablonski 2016-11-29
9490439 Planarization layer for organic electronic devices Piotr Wierzchowiec, Tomas Backlund, Li Wei Tan, Irina Afonina, Pawel Miskiewicz +2 more 2016-11-08
9468890 Cycloalkylnorbornene monomers, polymers derived therefrom and their use in pervaporation Leah Langsdorf, Oleksandr Burtovyy 2016-10-18
9425404 Thermo-oxidatively stable, side chain polyether functionalized polynorbornenes for microelectronic and optoelectronic devices and assemblies thereof Christopher Apanius, Cheryl Burns, Crystal Cyrus, Edmund Elce, Royce Groff +5 more 2016-08-23
9415354 Organopalladium compounds as polymerization catalysts 2016-08-16
9382271 Process for the preparation of high purity norbornene alkanols and derivatives thereof Dane Jablonski 2016-07-05
9331281 Bank structures for organic electronic devices Pawel Miskiewicz, Tomas Backlund, Philip Edward May, Toby Cull, Larry F. Rhodes +1 more 2016-05-03
9328126 Norbornenylhydrocarbylene dihydrocarbylboranes and methods of making the same Keitaro Seto, Stephen Westcott, Robert G Potter 2016-05-03
9263416 Methods and materials useful for chip stacking, chip and wafer bonding Christopher Apanius, Robert A. Shick, Hendra Ng, Wei Zhang, Phillip S. Neal 2016-02-16