Issued Patents All Time
Showing 26–50 of 73 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7776657 | Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same | Ashay Dani, Anna M. Prakash, Mitesh Patel, Vijay Wakharkar | 2010-08-17 |
| 7718216 | Low temperature bumping process | Terry Sterrett, Tian-An Chen | 2010-05-18 |
| 7534649 | Thermoset polyimides for microelectronic applications | Stephen Lehman, James C. Matayabas, Jr. | 2009-05-19 |
| 7521115 | Low temperature bumping process | Terry Sterrett, Tian-An Chen | 2009-04-21 |
| 7479449 | Underfill and mold compounds including siloxane-based aromatic diamines | — | 2009-01-20 |
| 7473995 | Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly | Christopher L. Rumer, Sabina J. Houle, Paul A. Koning, Ashay Dani | 2009-01-06 |
| 7423096 | Underfill of resin and sulfonic acid-releasing thermally cleavable compound | — | 2008-09-09 |
| 7387841 | Silicone-based cyanate-ester cross-linkable die attach adhesive | — | 2008-06-17 |
| 7378456 | Directly photodefinable polymer compositions and methods thereof | Edmund Elce, Ramakrishna Ravikiran, Larry F. Rhodes, Robert A. Shick | 2008-05-27 |
| 7332807 | Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same | Ashay Dani, Anna M. Prakash, Mitesh Patel, Vijay Wakharkar | 2008-02-19 |
| 7314778 | Wafer-level processing of chip-packaging compositions including bis-maleimides | Stephen Lehman | 2008-01-01 |
| 7312292 | Polycyclic polymers containing pendant ion conducting moieties | Ravi Ravikiran, Xiaoming Wu, Larry F. Rhodes, Robert A. Shick, Hiroko Nakano +4 more | 2007-12-25 |
| 7311967 | Thermal interface material and electronic assembly having such a thermal interface material | Ashay Dani, Paul A. Koning, Christopher L. Rumer | 2007-12-25 |
| 7294394 | Phase change material containing fusible particles as thermally conductive filler | Paul A. Koning, Ashay Dani | 2007-11-13 |
| 7294915 | Underfill and mold compounds including siloxane-based aromatic diamines | — | 2007-11-13 |
| 7291548 | Stress-relief layers and stress-compensation collars with low-temperature solders for board-level joints, and processes of making same | Daewoong Suh, Stephen Lehman, Mitesh Patel, Tiffany Byrne, Edward L. Martin +4 more | 2007-11-06 |
| 7252877 | Polymer matrices for polymer solder hybrid materials | Paul A. Koning, Ashay Dani | 2007-08-07 |
| 7253088 | Stress-relief layers and stress-compensation collars with low-temperature solders for board-level joints, and processes of making same | Daewoong Suh, Stephen Lehman, Mitesh Patel, Tiffany Byrne, Edward L. Martin +4 more | 2007-08-07 |
| 7244634 | Stress-relief layer and stress-compensation collar in contact arrays, and processes of making same | Daewoong Suh, Mohd Erwan P. Bin Basiron, Sheau Hooi Lim, Yoong Tatt Chin | 2007-07-17 |
| 7211638 | Silicone-based cyanate-ester cross-linkable die attach adhesive | — | 2007-05-01 |
| 7202304 | Anhydride polymers for use as curing agents in epoxy resin-based underfill material | Rahul N. Manepalli | 2007-04-10 |
| 7183139 | Flip-chip system and method of making same | Vijay Wakharkar | 2007-02-27 |
| 7084492 | Underfill and mold compounds including siloxane-based aromatic diamines | — | 2006-08-01 |
| 7041736 | Anhydride polymers for use as curing agents in epoxy resin-based underfill material | Rahul N. Manepalli | 2006-05-09 |
| 7022790 | Photosensitive compositions based on polycyclic polymers | Edmund Elce, Takashi Hirano, Jeffrey C. Krotine, Larry F. Rhodes, Brian L. Goodall +2 more | 2006-04-04 |