{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Microelectronic devices having underfill materials with improved fluxing agents", "item": "https://www.patentleaderboard.com/patent/7303944"}]}
Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Microelectronic devices having underfill materials with improved fluxing agents

Microelectronic devices having underfill materials with improved fluxing agents

US Patent 7303944 · Granted Dec 4, 2007

Estimated economic value: $21,616,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Light curable composition2023
Photo-curable liquid optically clear adhesive composition and the use thereof2023
Photo-curable adhesive composition, preparation and use thereof2020
Ultra-violet-curable and moisture-curable adhesive composition2019
Process for binding substrates with a liquid optically clear photo-curable adhes2018
Triply curable optically clear adhesive2017
Dual-curable adhesive composition, use thereof, and process for bonding substrat2017
Optical transparent dual cure adhesives composition2017
Photocurable adhesive composition and use of the same2017
Solder paste composition, a solder paste and a soldering flux2016
Microelectronic package having direct contact heat spreader and method of manufa2016
Method for bonding substrates using a UV radiation curing-redox curing adhesive 2015