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Undercarriage inspection assemblies and systems |
Mabby Nicholas Amouie, Evan Thomas Gebhardt, Colin Usher, Alex Samoylov, Sean Thomas +3 more |
2025-07-22 |
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| 12348880 |
Rail-side inspection assemblies and systems |
Mabby Nicholas Amouie, Evan Thomas Gebhardt, Colin Usher, Alex Samoylov, Sean Thomas +3 more |
2025-07-01 |
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| 12201740 |
Automated robotic system and method for sanitization and disinfection |
Sherylinn Hoang |
2025-01-21 |
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| 12080592 |
Film stack simplification for high aspect ratio patterning and vertical scaling |
Hui-Jung Wu, Bart J. van Schravendijk, Mark Kawaguchi, Gereng Gunawan, Jay E. Uglow +11 more |
2024-09-03 |
$105,811,000 |
| 11832533 |
Conformal damage-free encapsulation of chalcogenide materials |
James S. Sims, Andrew John McKerrow, Meihua Shen, Thorsten Lill, Shane Tang +4 more |
2023-11-28 |
$227,123,000 |
| 11792987 |
Self-aligned vertical integration of three-terminal memory devices |
Thorsten Lill, Meihua Shen, Hui-Jung Wu, Gereng Gunawan, Yang Pan |
2023-10-17 |
$212,669,000 |
| 11723998 |
Automated robotic system and method for sanitization and disinfection |
Sherylinn Hoang |
2023-08-15 |
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| 11511008 |
Automated robotic system and method for sanitization and disinfection |
Sherylinn Hoang |
2022-11-29 |
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| 11239420 |
Conformal damage-free encapsulation of chalcogenide materials |
James S. Sims, Andrew John McKerrow, Meihua Shen, Thorsten Lill, Shane Tang +4 more |
2022-02-01 |
$175,197,000 |
| 10784086 |
Cobalt etch back |
Jialing Yang, Baosuo Zhou, Meihua Shen, Thorsten Lill |
2020-09-22 |
$81,598,000 |
| 10199235 |
Liner and barrier applications for subtractive metal integration |
Hui-Jung Wu, Thomas Knisley, Nagraj Shankar, Meihua Shen, Prithu Sharma |
2019-02-05 |
$44,467,000 |
| 9899234 |
Liner and barrier applications for subtractive metal integration |
Hui-Jung Wu, Thomas Knisley, Nagraj Shankar, Meihua Shen, Prithu Sharma |
2018-02-20 |
$51,409,000 |
| 9870899 |
Cobalt etch back |
Jialing Yang, Baosuo Zhou, Meihua Shen, Thorsten Lill |
2018-01-16 |
$36,071,000 |
| 9589853 |
Method of planarizing an upper surface of a semiconductor substrate in a plasma etch chamber |
Monica Titus, Gowri Kamarthy, Harmeet Singh, Yoshie Kimura, Meihua Shen +2 more |
2017-03-07 |
$17,481,000 |
| 9570320 |
Method to etch copper barrier film |
Meihua Shen, Ji Zhu, Shuogang Huang, Baosuo Zhou, Prithu Sharma +1 more |
2017-02-14 |
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| 7928754 |
Wafer level burn-in and electrical test system and method |
Donald P. Richmond, II, Jerzy Lobacz |
2011-04-19 |
$276,000 |
| 7619428 |
Wafer level burn-in and electrical test system and method |
Donald P. Richmond, II, Jerzy Lobacz |
2009-11-17 |
$306,000 |
| 6682945 |
Wafer level burn-in and electrical test system and method |
Donald P. Richmond, II, Jerzy Lobacz |
2004-01-27 |
$811,000 |
| 6562636 |
Wafer level burn-in and electrical test system and method |
Donald P. Richmond, II, Jerry Lobacz |
2003-05-13 |
$347,000 |
| 5429510 |
High-density interconnect technique |
William D. Barraclough, Mikhail A. Alperin, Jeffrey A. Brehm, Patrick M. Shepherd, James F. Tomic |
1995-07-04 |
|
