Issued Patents All Time
Showing 51–75 of 88 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6833052 | Deposition chamber and method for depositing low dielectric constant films | Yaxin Wang, Fred C. Redeker, Tetsuya Ishikawa, Alan W. Collins | 2004-12-21 |
| 6821881 | Method for chemical mechanical polishing of semiconductor substrates | Stan Tsai, Liang-Yuh Chen, Lizhong Sun, Feng Q. Liu, Rashid Mavliev +2 more | 2004-11-23 |
| 6796880 | Linear polishing sheet with window | Fred C. Redeker, Manoocher Birang, Sasson Somekh | 2004-09-28 |
| 6790768 | Methods and apparatus for polishing substrates comprising conductive and dielectric materials with reduced topographical defects | Yongsik Moon, David H. Mai, Kapila Wijekoon, Rajeev Bajaj, Rahul Surana +6 more | 2004-09-14 |
| 6780773 | Method of chemical mechanical polishing with high throughput and low dishing | Jui-Lung Li, Shi-Ping Wang, Gary Lam, David H. Mai, Fred C. Redeker | 2004-08-24 |
| 6709316 | Method and apparatus for two-step barrier layer polishing | Lizhong Sun, Stan Tsai | 2004-03-23 |
| 6676497 | Vibration damping in a chemical mechanical polishing system | Hung Chih Chen, John M. White, Fred C. Redeker, Ramin Emami | 2004-01-13 |
| 6669538 | Pad cleaning for a CMP system | Ramin Emami, Sen-Hou Ko, Shi-Ping Wang, Fred C. Redeker, Lizhong Sun +1 more | 2003-12-30 |
| 6659849 | Platen with debris control for chemical mechanical planarization | Jayakumar Gurusamy, Manoocher Birang, Fred C. Redeker | 2003-12-09 |
| 6656842 | Barrier layer buffing after Cu CMP | Fred C. Redeker, Ramin Emami, Sen-Hou Ko, John M. White | 2003-12-02 |
| 6653242 | Solution to metal re-deposition during substrate planarization | Lizhong Sun, Stan Tsai, John M. White | 2003-11-25 |
| 6623334 | Chemical mechanical polishing with friction-based control | Manoocher Birang | 2003-09-23 |
| 6613200 | Electro-chemical plating with reduced thickness and integration with chemical mechanical polisher into a single platform | Stan Tsai, Lizhong Sun | 2003-09-02 |
| 6592439 | Platen for retaining polishing material | Manoocher Birang, Ramin Emami, Andrew J. Nagengast, Douglas Orcutt Brown, Shi-Ping Wang +2 more | 2003-07-15 |
| 6592742 | Electrochemically assisted chemical polish | Lizhong Sun | 2003-07-15 |
| 6589610 | Deposition chamber and method for depositing low dielectric constant films | Yaxin Wang, Fred C. Redeker, Tetsuya Ishikawa, Alan W. Collins | 2003-07-08 |
| 6585563 | In-situ monitoring of linear substrate polishing operations | Fred C. Redeker, Manoocher Birang, Sasson Somekh | 2003-07-01 |
| 6541384 | Method of initiating cooper CMP process | Lizhong Sun, Stan Tsai, John M. White | 2003-04-01 |
| 6524167 | Method and composition for the selective removal of residual materials and barrier materials during substrate planarization | Stan Tsai, Lizhong Sun | 2003-02-25 |
| 6509269 | Elimination of pad glazing for Al CMP | Lizhong Sun, Fred C. Redeker | 2003-01-21 |
| 6485359 | Platen arrangement for a chemical-mechanical planarization apparatus | Fred C. Redeker, John M. White, Manoocher Birang | 2002-11-26 |
| 6465051 | Method of operating high density plasma CVD reactor with combined inductive and capacitive coupling | Turgut Sahin, Fred C. Redeker, Romuald Nowak, Timothy Dyer, Derek R. Witty | 2002-10-15 |
| 6451697 | Method for abrasive-free metal CMP in passivation domain | Lizhong Sun, Fritz Redeker | 2002-09-17 |
| 6432826 | Planarized Cu cleaning for reduced defects | Ramin Emami, Sen-Hou Ko, Fred C. Redeker, Madhavi R. Chandrachood | 2002-08-13 |
| 6416823 | Deposition chamber and method for depositing low dielectric constant films | Yaxin Wang, Fred C. Redeker, Tetsuya Ishikawa, Alan W. Collins | 2002-07-09 |