Issued Patents All Time
Showing 26–50 of 88 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7413627 | Deposition chamber and method for depositing low dielectric constant films | Yaxin Wang, Fred C. Redeker, Tetsuya Ishikawa, Alan W. Collins | 2008-08-19 |
| 7375023 | Method and apparatus for chemical mechanical polishing of semiconductor substrates | Stan Tsai, Liang-Yuh Chen, Lizhong Sun, Feng Q. Liu, Rashid Mavliev +2 more | 2008-05-20 |
| 7331847 | Vibration damping in chemical mechanical polishing system | Hung Chih Chen, John M. White, Fred C. Redeker, Ramin Emami | 2008-02-19 |
| 7232761 | Method of chemical mechanical polishing with high throughput and low dishing | Jui-Lung Li, Shi-Ping Wang, Gary Lam, David H. Mai, Fred C. Redeker | 2007-06-19 |
| 7220322 | Cu CMP polishing pad cleaning | Lizhong Sun, Fred C. Redeker | 2007-05-22 |
| 7201636 | Chemical mechanical polishing a substrate having a filler layer and a stop layer | Raymond R. Jin, Fred C. Redeker, Thomas H. Osterheld | 2007-04-10 |
| 7104267 | Planarized copper cleaning for reduced defects | Ramin Emami, Sen-Hou Ko, Fred C. Redeker, Madhavi R. Chandrachood | 2006-09-12 |
| 7060606 | Method and apparatus for chemical mechanical polishing of semiconductor substrates | Stan Tsai, Liang-Yuh Chen, Lizhong Sun, Feng Q. Liu, Rashid Mavliev +2 more | 2006-06-13 |
| 7059948 | Articles for polishing semiconductor substrates | Llang-Yuh Chen, Alain Duboust | 2006-06-13 |
| 7041599 | High through-put Cu CMP with significantly reduced erosion and dishing | Fred C. Redeker, John M. White, Ramin Emami | 2006-05-09 |
| 7022608 | Method and composition for the removal of residual materials during substrate planarization | Lizhong Sun, Stan Tsai | 2006-04-04 |
| 7014545 | Vibration damping in a chemical mechanical polishing system | Hung Chih Chen, John M. White, Fred C. Redeker, Ramin Emami | 2006-03-21 |
| 7014538 | Article for polishing semiconductor substrates | Lawrence Rosenberg, Manoocher Birang, John M. White, Marty Scales, Ramin Emami +1 more | 2006-03-21 |
| 7012025 | Tantalum removal during chemical mechanical polishing | Lizhong Sun, Stan Tsai, Feng Q. Liu | 2006-03-14 |
| 7008554 | Dual reduced agents for barrier removal in chemical mechanical polishing | Stan Tsai, Feng Q. Liu, Lizhong Sun, Liang-Yuh Chen | 2006-03-07 |
| 6991517 | Linear polishing sheet with window | Fred C. Redeker, Manoocher Birang, Sasson Somekh | 2006-01-31 |
| 6960521 | Method and apparatus for polishing metal and dielectric substrates | Yongsik Moon, David H. Mai, Kapila Wijekoon, Rajeev Bajaj, Rahul Surana +6 more | 2005-11-01 |
| 6955516 | Single wafer dryer and drying methods | Younes Achkire, Alexander Lerner, Boris Govzman, Boris Fishkin, Michael Sugarman +4 more | 2005-10-18 |
| 6887129 | Chemical mechanical polishing with friction-based control | Manoocher Birang | 2005-05-03 |
| 6872329 | Chemical mechanical polishing composition and process | Yuchun Wang, Rajeev Bajaj, Fred C. Redeker | 2005-03-29 |
| 6863794 | Method and apparatus for forming metal layers | Stan Tsai | 2005-03-08 |
| 6863593 | Chemical mechanical polishing a substrate having a filler layer and a stop layer | Raymond R. Jin, Fred C. Redeker, Thomas H. Osterheld | 2005-03-08 |
| 6858265 | Technique for improving chucking reproducibility | Fred C. Redeker, Robert Steger | 2005-02-22 |
| 6858540 | Selective removal of tantalum-containing barrier layer during metal CMP | Lizhong Sun, Stan Tsai, Fred C. Redeker | 2005-02-22 |
| 6832948 | Thermal preconditioning fixed abrasive articles | Manoocher Birang, Ramin Emami, Fred C. Redeker | 2004-12-21 |