Issued Patents All Time
Showing 51–75 of 107 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7884017 | Thermal methods for cleaning post-CMP wafers | Zhonghui Wang, Tiruchirapalli Arunagiri, Fritz Redeker, John M. Boyd, Mikhail Korolik +3 more | 2011-02-08 |
| 7875554 | Method for electroless depositing a material on a surface of a wafer | John M. Boyd, William Thie, Bob Maraschin, Fred C. Redeker, Joel M. Cook | 2011-01-25 |
| 7862693 | Apparatus for plating semiconductor wafers | Fred C. Redeker, John M. Boyd, Robert A. Maraschin, Carl Woods | 2011-01-04 |
| 7829152 | Electroless plating method and apparatus | William Thie, John M. Boyd, Fritz Redeker | 2010-11-09 |
| 7811423 | Proximity processing using controlled batch volume with an integrated proximity head | Carl Woods, Jacob Wylie, Robert A. Maraschin | 2010-10-12 |
| 7752996 | Apparatus for applying a plating solution for electroless deposition | William Thie, John M. Boyd, Fritz Redeker, Aleksander Owczarz | 2010-07-13 |
| 7749893 | Methods and systems for low interfacial oxide contact between barrier and copper metallization | Fritz Redeker, John M. Boyd, Hyungsuk Alexander Yoon, Shijian Li | 2010-07-06 |
| 7709400 | Thermal methods for cleaning post-CMP wafers | Zhonghui Wang, Tiruchirapalli Arunagiri, Fritz Redeker, John M. Boyd, Mikhail Korolik +3 more | 2010-05-04 |
| 7704367 | Method and apparatus for plating semiconductor wafers | Bob Maraschin, John M. Boyd, Fred C. Redeker, Carl Woods | 2010-04-27 |
| 7686875 | Electroless deposition from non-aqueous solutions | Eugenijus Norkus, Jane Jaciauskiene | 2010-03-30 |
| 7662253 | Apparatus for the removal of a metal oxide from a substrate and methods therefor | Hyungsuk Alexander Yoon, William Thie, Andrew D. Bailey, III | 2010-02-16 |
| 7648616 | Apparatus and method for semiconductor wafer electroplanarization | John M. Boyd, Fritz Redeker, Michael Ravkin, Robert A. Maraschin | 2010-01-19 |
| 7645364 | Apparatus and method for plating semiconductor wafers | Fred C. Redeker, John M. Boyd, Robert A. Maraschin, Carl Woods | 2010-01-12 |
| 7615480 | Methods of post-contact back end of the line through-hole via integration | John M. Boyd, Fritz Redeker, Hyungsuk Alexander Yoon, Shijian Li | 2009-11-10 |
| 7615486 | Apparatus and method for integrated surface treatment and deposition for copper interconnect | Hyungsuk Alexander Yoon, Mikhail Korolik, Fritz Redeker, John M. Boyd | 2009-11-10 |
| 7598175 | Apparatus and method for confined area planarization | John M. Boyd, Fritz Redeker, Michael Ravkin, John M. de Larios | 2009-10-06 |
| 7592259 | Methods and systems for barrier layer surface passivation | John M. Boyd, Fritz Redeker, William Thie, Tiruchirapalli Arunagiri, Alex Yoon | 2009-09-22 |
| 7582565 | Method and apparatus for semiconductor wafer planarization | Fred C. Redeker, John M. Boyd, William Thie, Bob Maraschin | 2009-09-01 |
| 7563348 | Electroplating head and method for operating the same | Bob Maraschin, John M. Boyd, Fred C. Redeker | 2009-07-21 |
| 7521358 | Process integration scheme to lower overall dielectric constant in BEoL interconnect structures | Nicolas Bright, Dave Hemker, Fritz Redeker | 2009-04-21 |
| 7497932 | Electro-chemical deposition system | Mark Cassidy Cridlin Lloyd, Donald Olgado, Ratson Morad, Peter Hey, Mark Denome +10 more | 2009-03-03 |
| 7427338 | Flow diffuser to be used in electro-chemical plating system | Joseph Stevens, H. Peter W. Hey, Donald Olgado | 2008-09-23 |
| 7396430 | Apparatus and method for confined area planarization | John M. Boyd, Fritz Redeker, Michael Ravkin, John M. de Larios | 2008-07-08 |
| 7368017 | Method and apparatus for semiconductor wafer planarization | Fred C. Redeker, John M. Boyd, William Thie, Bob Maraschin | 2008-05-06 |
| 7358186 | Method and apparatus for material deposition in semiconductor fabrication | John M. Boyd, William Thie, Bob Maraschin, Fred C. Redeker, Joel M. Cook | 2008-04-15 |