Issued Patents All Time
Showing 101–107 of 107 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6258223 | In-situ electroless copper seed layer enhancement in an electroplating system | Robin Cheung, Daniel Carl, Peter Hey, Ratson Morad, Liang-Yuh Chen +2 more | 2001-07-10 |
| 6258220 | Electro-chemical deposition system | Donald Olgado, Ratson Morad, Peter Hey, Mark Denome, Michael Sugarman +10 more | 2001-07-10 |
| 6254760 | Electro-chemical deposition system and method | Ben Shen, George Birkmaier | 2001-07-03 |
| 5859474 | Reflow ball grid array assembly | — | 1999-01-12 |
| 5835355 | Tape ball grid array package with perforated metal stiffener | — | 1998-11-10 |
| 5776800 | Paddleless molded plastic semiconductor chip package | William Hamburgen, John S. Fitch | 1998-07-07 |
| 5604376 | Paddleless molded plastic semiconductor chip package | William Hamburgen, John S. Fitch | 1997-02-18 |