Issued Patents All Time
Showing 76–100 of 107 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7297190 | Plating solutions for electroless deposition of copper | William Thie, Algirdas Vaskelis, Eugenijus Norkus, Jane Jaciauskiene, Aldona Jagminiene | 2007-11-20 |
| 7252736 | Compliant grinding wheel | John M. Boyd, Fred C. Redeker | 2007-08-07 |
| 7247222 | Electrochemical processing cell | Michael Yang, Dmitry Lubomirsky, Saravjeet Singh, Sheshraj Tulshibagwale, Nicolay Kovarsky | 2007-07-24 |
| 7192494 | Method and apparatus for annealing copper films | B. Chen, Ho Seon Shin, Ratson Morad, Robin Cheung | 2007-03-20 |
| 7153400 | Apparatus and method for depositing and planarizing thin films of semiconductor wafers | Mike Ravkin, John M. Boyd, Fred C. Redeker, John M. de Larios | 2006-12-26 |
| 7108591 | Compliant wafer chuck | John M. Boyd, Fred C. Redeker | 2006-09-19 |
| 7090562 | Methods of and apparatus for pre-planarizing a substrate | John M. Boyd, Fred C. Redeker | 2006-08-15 |
| 7048608 | Semiconductor wafer material removal apparatus and method for operating the same | John M. Boyd, Fred C. Redeker | 2006-05-23 |
| 6893548 | Method of conditioning electrochemical baths in plating technology | Robin Cheung, Daniel Carl, Liang-Yuh Chen, Paul Smith, Ratson Morad +2 more | 2005-05-17 |
| 6881318 | Dynamic pulse plating for high aspect ratio features | H. Peter W. Hey | 2005-04-19 |
| 6837978 | Deposition uniformity control for electroplating apparatus, and associated method | H. Peter W. Hey, Donald Olgado, Mark Denome | 2005-01-04 |
| 6645550 | Method of treating a substrate | Robin Cheung, Jennifer Meng Chu Tseng | 2003-11-11 |
| 6635157 | Electro-chemical deposition system | Donald Olgado, Ratson Morad, Peter Hey, Mark Denome, Michael Sugarman +10 more | 2003-10-21 |
| 6613214 | Electric contact element for electrochemical deposition system and method | Joseph Stevens | 2003-09-02 |
| 6599402 | Electro-chemical deposition cell for face-up processing of single semiconductor substrates | Joe Stevens, Roy Edwards, Bob Lowrance, Michael Sugarman, Mark Denome | 2003-07-29 |
| 6585876 | Flow diffuser to be used in electro-chemical plating system and method | Joseph Stevens, H. Peter W. Hey, Donald Olgado | 2003-07-01 |
| 6582578 | Method and associated apparatus for tilting a substrate upon entry for metal deposition | Joseph Stevens, Michael Sugarman | 2003-06-24 |
| 6572010 | Integrated solder bump deposition apparatus and method | Robin Cheung | 2003-06-03 |
| 6551484 | Reverse voltage bias for electro-chemical plating system and method | H. Peter W. Hey | 2003-04-22 |
| 6521102 | Perforated anode for uniform deposition of a metal layer | — | 2003-02-18 |
| 6494219 | Apparatus with etchant mixing assembly for removal of unwanted electroplating deposits | Radha Nayak, Joseph Stevens, Peter Hey | 2002-12-17 |
| 6436267 | Method for achieving copper fill of high aspect ratio interconnect features | Daniel Carl, Barry Chin, Liang-Yuh Chen, Robin Cheung, Peijun Ding +3 more | 2002-08-20 |
| 6423636 | Process sequence for improved seed layer productivity and achieving 3mm edge exclusion for a copper metalization process on semiconductor wafer | Michael Sugarman | 2002-07-23 |
| 6416647 | Electro-chemical deposition cell for face-up processing of single semiconductor substrates | Joe Stevens, Roy Edwards, Bob Lowrance, Michael Sugarman, Mark Denome | 2002-07-09 |
| 6267853 | Electro-chemical deposition system | Muhammad Malik, Henan Hao, Timothy Franklin, Joe Stevens, Donald Olgado | 2001-07-31 |