Issued Patents All Time
Showing 26–47 of 47 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7025861 | Contact plating apparatus | Nicolay Kovarsky, Dmitry Lubomirsky | 2006-04-11 |
| 7026238 | Reliability barrier integration for Cu application | Ming Xi, Paul Smith, Ling Chen, Mei Chang, Fusen Chen +2 more | 2006-04-11 |
| 6998014 | Apparatus and method for plasma assisted deposition | Chen-An Chen, Avgerinos V. Gelatos, Ming Xi, Mark Hytros | 2006-02-14 |
| 6951804 | Formation of a tantalum-nitride layer | Sean M. Seutter, Ming Xi | 2005-10-04 |
| 6939801 | Selective deposition of a barrier layer on a dielectric material | Hua Chung, Ling Chen, Vincent Ku, Gongda Yao | 2005-09-06 |
| 6939804 | Formation of composite tungsten films | Ken Kaung Lai, Jeong Soo Byun, Frederick Wu, Ramanujapuran A. Srinivas, Avgerinos V. Gelatos +7 more | 2005-09-06 |
| 6911391 | Integration of titanium and titanium nitride layers | Toshio Itoh, Ming Xi | 2005-06-28 |
| 6869516 | Method for removing electrolyte from electrical contacts and wafer touching areas | Dmitry Lubomirsky, Girish Dixit, Vincent E. Burkhart, Allen L. D'Ambra, Yeuk-Fai Edwin Mok +1 more | 2005-03-22 |
| 6846516 | Multiple precursor cyclical deposition system | Hyungsuk Alexander Yoon, Hui Zhang, Hongbin Fang, Ming Xi | 2005-01-25 |
| 6827978 | Deposition of tungsten films | Hyungsuk Alexander Yoon, Hongbin Fang | 2004-12-07 |
| 6809026 | Selective deposition of a barrier layer on a metal film | Hyungsuk Alexander Yoon, Hui Zhang, Soonil Hong, Ming Xi | 2004-10-26 |
| 6797340 | Method for depositing refractory metal layers employing sequential deposition techniques | Hongbin Fang, Hyung-Suk Yoon, Ken Kaung Lai, Chi C. Young, James Horng +2 more | 2004-09-28 |
| 6734020 | Valve control system for atomic layer deposition chamber | Siqing Lu, Yu-Chia Chang, Dongxi Sun, Vinh Dang, Anzhong Chang +2 more | 2004-05-11 |
| 6720027 | Cyclical deposition of a variable content titanium silicon nitride layer | Ming Xi | 2004-04-13 |
| 6699380 | Modular electrochemical processing system | Guan-Shian CHEN | 2004-03-02 |
| 6660126 | Lid assembly for a processing system to facilitate sequential deposition techniques | Anh N. Nguyen, Ming Xi, Hua Chung, Anzhong Chang, Xiaoxiong Yuan +1 more | 2003-12-09 |
| 6646235 | Multi-zone resistive heater | Steven Chen, Henry Ho, Bruce W. Peuse, Karl A. Littau, Yu-Chia Chang | 2003-11-11 |
| 6645884 | Method of forming a silicon nitride layer on a substrate | Chien-Teh Kao, Karl A. Littau, Steven Chen, Henry Ho, Ying Yu | 2003-11-11 |
| 6530992 | Method of forming a film in a chamber and positioning a substitute in a chamber | Henry Ho, Steven Chen | 2003-03-11 |
| 6455421 | Plasma treatment of tantalum nitride compound films formed by chemical vapor deposition | Toshio Itoh, Christophe Marcadal | 2002-09-24 |
| 6423949 | Multi-zone resistive heater | Steven Chen, Henry Ho, Bruce W. Peuse, Karl A. Littau, Yu-Chia Chang | 2002-07-23 |
| 6218301 | Deposition of tungsten films from W(CO)6 | Hyungsuk Alexander Yoon, Ming Xi | 2001-04-17 |