Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10192837 | Multi-via redistribution layer for integrated circuits having solder balls | CHUNG-HSIUNG HO, Richard Te Gan, James Spehar | 2019-01-29 |
| 8320351 | Automatic handling of neighbour cells | Hans Aqvist | 2012-11-27 |