Issued Patents All Time
Showing 26–50 of 87 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532532 | Composite media protection for pressure sensor | — | 2022-12-20 |
| 11498829 | No-gel pressure sensor package | Stephen R. Hooper, Mark E. Schlarmann, Scott M. Hayes, Julien Juéry | 2022-11-15 |
| 11456227 | Topside heatsinking antenna launcher for an integrated circuit package | Antonius Johannes Matheus de Graauw, Giorgio Carluccio, Waqas Hassan Syed, Maristella Spella | 2022-09-27 |
| 11404288 | Semiconductor device packaging warpage control | Scott M. Hayes, Zhiwei Gong, Vivek Gupta, Richard Te Gan | 2022-08-02 |
| 11335652 | Method, system, and apparatus for forming three-dimensional semiconductor device package with waveguide | Scott M. Hayes, Zhiwei Gong, Stephen R. Hooper | 2022-05-17 |
| 11276654 | Bottom-side heatsinking waveguide for an integrated circuit package | Antonius Johannes Matheus de Graauw, Giorgio Carluccio, Waqas Hassan Syed, Maristella Spella | 2022-03-15 |
| 11133273 | Semiconductor device with waveguide and method therefor | Giorgio Carluccio, Maristella Spella, Scott M. Hayes | 2021-09-28 |
| 11133578 | Semiconductor device package comprising an encapsulated and conductively shielded semiconductor device die that provides an antenna feed to a waveguide | Antonius Hendrikus Jozef Kamphuis, Antonius Johannes Matheus de Graauw, Adrianus Buijsman | 2021-09-28 |
| 11127645 | Grounding lids in integrated circuit devices | Dwight L. Daniels, Stephen R. Hooper | 2021-09-21 |
| 11121467 | Semiconductor package with compact antenna formed using three-dimensional additive manufacturing process | Jinbang Tang, Zhiwei Gong, Betty Hill-Shan Yeung | 2021-09-14 |
| 11031681 | Package integrated waveguide | Scott M. Hayes, Zhiwei Gong, Stephen R. Hooper, Pascal Oberndorff, Walter Parmon | 2021-06-08 |
| 10834817 | Plated opening with vent path | Zhiwei Gong, Scott M. Hayes | 2020-11-10 |
| 10658303 | High aspect ratio connection for EMI shielding | Stephen R. Hooper, Dwight L. Daniels | 2020-05-19 |
| 10654709 | Shielded semiconductor device and lead frame therefor | Lee Fee Ngion, Zi Song Poh | 2020-05-19 |
| 10529670 | Shielded package with integrated antenna | Gregory J. Durnan | 2020-01-07 |
| 10440819 | Fan-out wafer level packages having preformed embedded ground plane connections | — | 2019-10-08 |
| 10388607 | Microelectronic devices with multi-layer package surface conductors and methods of their fabrication | Zhiwei Gong, Scott M. Hayes | 2019-08-20 |
| 10381295 | Lead frame having redistribution layer | Ryan Hooper, Dwight L. Daniels | 2019-08-13 |
| 10354958 | Through package circuit in fan-out wafer level package | — | 2019-07-16 |
| 10236260 | Shielded package with integrated antenna | Gregory J. Durnan | 2019-03-19 |
| 10163874 | Packaged devices with multiple planes of embedded electronic devices | Zhiwei Gong, Scott M. Hayes | 2018-12-25 |
| 10143084 | Plated opening with vent path | Zhiwei Gong, Scott M. Hayes | 2018-11-27 |
| 10074614 | EMI/RFI shielding for semiconductor device packages | Zhiwei Gong, Scott M. Hayes | 2018-09-11 |
| 9960149 | Devices and stacked microelectronic packages with package surface conductors and methods of their fabrication | Scott M. Hayes | 2018-05-01 |
| 9899298 | Microelectronic packages having mold-embedded traces and methods for the production thereof | Zhiwei Gong, Jason Wright | 2018-02-20 |