Issued Patents All Time
Showing 76–87 of 87 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9025340 | Devices and stacked microelectronic packages with in-trench package surface conductors and methods of their fabrication | Jason Wright, Weng F. Yap | 2015-05-05 |
| 8592299 | Solder and electrically conductive adhesive based interconnection for CZT crystal attach | Voya R. Markovich, Rabindra N. Das, Rajinder S. Rai | 2013-11-26 |
| 8293141 | Electronic device comprising electrically stable copper filled electrically conductive adhesive | Michael A. Gaynes, Jeffrey D. Gelorme, Luis J. Matienzo, Rebecca Suzanne Northey | 2012-10-23 |
| 7763188 | Electrically stable copper filled electrically conductive adhesive | Michael A. Gaynes, Jeffrey D. Gelorme, Luis J. Matienzo, Rebecca Suzanne Northey | 2010-07-27 |
| 7408264 | SMT passive device noflow underfill methodology and structure | Clement Fortin, Pierre Langevin, Son K. Tran | 2008-08-05 |
| 7196526 | Matched delay line voltage converter | Dragan Maksimovic | 2007-03-27 |
| 7109592 | SMT passive device noflow underfill methodology and structure | Clement Fortin, Pierre Langevin, Son K. Tran | 2006-09-19 |
| 7094966 | Packaging integrated circuits with adhesive posts | Barry A. Bonitz, Eric A. Johnson | 2006-08-22 |
| 6958721 | Matched delay line voltage converter | Dragan Maksimovic | 2005-10-25 |
| 6815258 | Flip-chip package with underfill having low density filler | — | 2004-11-09 |
| 6739497 | SMT passive device noflow underfill methodology and structure | Clement Fortin, Pierre Langevin, Son K. Tran | 2004-05-25 |
| 6674172 | Flip-chip package with underfill having low density filler | — | 2004-01-06 |