Issued Patents All Time
Showing 51–75 of 87 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9826630 | Fan-out wafer level packages having preformed embedded ground plane connections and methods for the fabrication thereof | — | 2017-11-21 |
| 9799636 | Packaged devices with multiple planes of embedded electronic devices | Zhiwei Gong, Scott M. Hayes | 2017-10-24 |
| 9761570 | Electronic component package with multple electronic components | Jason Wright | 2017-09-12 |
| 9761565 | Microelectronic packages having embedded sidewall substrates and methods for the producing thereof | Scott M. Hayes | 2017-09-12 |
| 9698104 | Integrated electronic package and stacked assembly thereof | Weng F. Yap | 2017-07-04 |
| 9673150 | EMI/RFI shielding for semiconductor device packages | Zhiwei Gong, Scott M. Hayes | 2017-06-06 |
| 9595485 | Microelectronic packages having embedded sidewall substrates and methods for the producing thereof | Scott M. Hayes | 2017-03-14 |
| 9570387 | Three-dimensional integrated circuit systems in a package and methods therefor | Zhiwei Gong, Scott M. Hayes | 2017-02-14 |
| 9524950 | Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereof | Weng F. Yap | 2016-12-20 |
| 9520323 | Microelectronic packages having trench vias and methods for the manufacture thereof | Zhiwei Gong, Scott M. Hayes, Douglas G. Mitchell | 2016-12-13 |
| 9502363 | Wafer level packages and methods for producing wafer level packages having delamination-resistant redistribution layers | Trung Q. Duong, Zhiwei Gong, Scott M. Hayes, Alan J. Magnus, Douglas G. Mitchell +3 more | 2016-11-22 |
| 9396999 | Wafer level packaging method | Weng F. Yap | 2016-07-19 |
| 9355985 | Microelectronic packages having sidewall-deposited heat spreader structures and methods for the fabrication thereof | Scott M. Hayes | 2016-05-31 |
| 9331029 | Microelectronic packages having mold-embedded traces and methods for the production thereof | Zhiwei Gong, Jason Wright | 2016-05-03 |
| 9305911 | Devices and stacked microelectronic packages with package surface conductors and adjacent trenches and methods of their fabrication | Jason Wright, Weng F. Yap | 2016-04-05 |
| 9299670 | Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereof | Weng F. Yap, Jason Wright | 2016-03-29 |
| 9281293 | Microelectronic packages having layered interconnect structures and methods for the manufacture thereof | Alan J. Magnus, Trung Q. Duong, Zhiwei Gong, Scott M. Hayes, Douglas G. Mitchell +2 more | 2016-03-08 |
| 9263420 | Devices and stacked microelectronic packages with package surface conductors and methods of their fabrication | Scott M. Hayes | 2016-02-16 |
| 9257415 | Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereof | Scott M. Hayes, Jason Wright, Zhiwei Gong | 2016-02-09 |
| 9245819 | Embedded electrical component surface interconnect | — | 2016-01-26 |
| 9190390 | Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereof | Zhiwei Gong, Scott M. Hayes, Jason Wright | 2015-11-17 |
| 9111870 | Microelectronic packages containing stacked microelectronic devices and methods for the fabrication thereof | — | 2015-08-18 |
| 9093457 | Stacked microelectronic packages having patterned sidewall conductors and methods for the fabrication thereof | Zhiwei Gong, Scott M. Hayes, Jason Wright | 2015-07-28 |
| 9064977 | Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereof | Zhiwei Gong (Tony), Scott M. Hayes, Jason Wright | 2015-06-23 |
| 9036363 | Devices and stacked microelectronic packages with parallel conductors and intra-conductor isolator structures and methods of their fabrication | Zhiwei Gong | 2015-05-19 |