Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4890156 | Multichip IC module having coplanar dice and substrate | James E. Drye | 1989-12-26 |
| 4792533 | Coplanar die to substrate bond method | James E. Drye | 1988-12-20 |
SP
Steven L. Post
Overall (All Time): #2,334,423 of 4,157,543Top 60%
2
Patents All Time