Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9070787 | Package-on-package assembly and method | Thor Soo Fung, Fong Chin Yee | 2015-06-30 |
| 6413849 | Integrated circuit package with surface mounted pins on an organic substrate and method of fabrication therefor | Hwai-Peng Yeoh, Hamid Azimi, Mirng-Ji Lii | 2002-07-02 |