Issued Patents All Time
Showing 25 most recent of 58 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12405434 | Embedding a photonic integrated circuit in a semiconductor package for high bandwidth memory and compute | Ankur Aggarwal, Philip Winterbottom, Martinus Bos | 2025-09-02 |
| 12399333 | Optical multi-die interconnect bridge with electrical and optical interfaces | Philip Winterbottom, David E. Lazovsky, Ankur Aggarwal, Martinus Bos | 2025-08-26 |
| 12401008 | Electrical interconnects for packages containing photonic integrated circuits | Matteo Staffaroni, Kevin Park, Saurabh Vats, Ismail H. Ozguc | 2025-08-26 |
| 12401007 | Electrical interconnects for packages containing photonic integrated circuits | Matteo Staffaroni, Kevin Park, Saurabh Vats, Ismail H. Ozguc | 2025-08-26 |
| 12401006 | Electrical interconnects for packages containing photonic integrated circuits | Matteo Staffaroni, Kevin Park, Saurabh Vats, Ismail H. Ozguc | 2025-08-26 |
| 12401009 | Electrical interconnects for packages containing photonic integrated circuits | Matteo Staffaroni, Kevin Park, Saurabh Vats, Ismail H. Ozguc | 2025-08-26 |
| 12392974 | Embedding a photonic integrated circuit in a semiconductor package for high bandwidth memory and compute | Ankur Aggarwal, Philip Winterbottom, Martinus Bos | 2025-08-19 |
| 12306437 | Temperature-stabilized integrated waveguides | Kamal V. Karimanal, Gianlorenzo Masini, Attila Mekis, Roman Bruck | 2025-05-20 |
| 12298608 | Optically bridged multicomponent package with extended temperature range | Philip Winterbottom, David E. Lazovsky, Ankur Aggarwal, Martinus Bos | 2025-05-13 |
| 12242122 | Multicomponent photonically intra-die bridged assembly | Philip Winterbottom, David E. Lazovsky, Ankur Aggarwal, Martinus Bos | 2025-03-04 |
| 12216318 | Optical bridging element for separately stacked electrical ICs | Philip Winterbottom, David E. Lazovsky, Ankur Aggarwal, Martinus Bos | 2025-02-04 |
| 12197023 | Manufacturing optically accessible co-packaged optics | Ankur Aggarwal, Philip Winterbottom | 2025-01-14 |
| 12189198 | Manufacturing optically accessible co-packaged optics | Ankur Aggarwal | 2025-01-07 |
| 12164161 | Stacked-dies optically bridged multicomponent package | Philip Winterbottom, David E. Lazovsky, Ankur Aggarwal, Martinus Bos | 2024-12-10 |
| 12164162 | Multicomponent photonically bridged assembly | Philip Winterbottom, David E. Lazovsky, Ankur Aggarwal, Martinus Bos | 2024-12-10 |
| 12160273 | Multi-protocol optical device | Brian Welch | 2024-12-03 |
| 12124095 | Optical multi-die interconnect bridge with optical interface | Philip Winterbottom, David E. Lazovsky, Ankur Aggarwal, Martinus Bos | 2024-10-22 |
| 11860412 | Temperature-stabilized integrated waveguides | Kamal V. Karimanal, Gianlorenzo Masini, Attila Mekis, Roman Bruck | 2024-01-02 |
| 11835777 | Optical multi-die interconnect bridge (OMIB) | Philip Winterbottom, David E. Lazovsky, Ankur Aggarwal, Martinus Bos | 2023-12-05 |
| 11796888 | Method and system for a vertical junction high-speed phase modulator | Attila Mekis, Yannick De Koninck, Gianlorenzo Masini, Faezeh Gholami | 2023-10-24 |
| 11735574 | Method and system for selectively illuminated integrated photodetectors with configured launching and adaptive junction profile for bandwidth improvement | Kam-Yan Hon, Gianlorenzo Masini, Attila Mekis | 2023-08-22 |
| 11217710 | Method and system for germanium-on-silicon photodetectors without germanium layer contacts | Kam-Yan Hon, Gianlorenzo Masini | 2022-01-04 |
| 11101400 | Method and system for a focused field avalanche photodiode | Gianlorenzo Masini, Kam-Yan Hon, Attila Mekis | 2021-08-24 |
| 11073738 | Method and system for a vertical junction high-speed phase modulator | Attila Mekis, Yannick De Koninck, Gianlorenzo Masini, Faezeh Gholami | 2021-07-27 |
| 11049851 | Method and system for selectively illuminated integrated photodetectors with configured launching and adaptive junction profile for bandwidth improvement | Kam-Yan Hon, Gianlorenzo Masini, Attila Mekis | 2021-06-29 |