| 12494403 |
Preserving access to optical components on a wafer package with sacrificial die |
Ankit Aggarwal, Anand Rathi, Suresh Pothukuchi |
2025-12-09 |
|
| 12468103 |
Optically bridged multicomponent package with extended temperature range |
Philip Winterbottom, David E. Lazovsky, Ankit Aggarwal, Martinus Bos |
2025-11-11 |
|
| 12442998 |
Optically bridged multicomponent package with extended temperature range |
Philip Winterbottom, David E. Lazovsky, Ankit Aggarwal, Martinus Bos |
2025-10-14 |
|
| 12442999 |
Optically bridged multicomponent package with extended temperature range |
Philip Winterbottom, David E. Lazovsky, Ankit Aggarwal, Martinus Bos |
2025-10-14 |
|
| 12442997 |
Optically bridged multicomponent package with extended temperature range |
Philip Winterbottom, David E. Lazovsky, Ankit Aggarwal, Martinus Bos |
2025-10-14 |
|
| 12443000 |
Optically bridged multicomponent package with extended temperature range |
Philip Winterbottom, David E. Lazovsky, Ankit Aggarwal, Martinus Bos |
2025-10-14 |
|
| 12436346 |
Optically bridged multicomponent package with extended temperature range |
Philip Winterbottom, David E. Lazovsky, Ankit Aggarwal, Martinus Bos |
2025-10-07 |
|
| 12405434 |
Embedding a photonic integrated circuit in a semiconductor package for high bandwidth memory and compute |
Ankur Aggarwal, Philip Winterbottom, Martinus Bos |
2025-09-02 |
|
| 12401009 |
Electrical interconnects for packages containing photonic integrated circuits |
Matteo Staffaroni, Kevin Park, Saurabh Vats, Ismail H. Ozguc |
2025-08-26 |
|
| 12401008 |
Electrical interconnects for packages containing photonic integrated circuits |
Matteo Staffaroni, Kevin Park, Saurabh Vats, Ismail H. Ozguc |
2025-08-26 |
|
| 12401007 |
Electrical interconnects for packages containing photonic integrated circuits |
Matteo Staffaroni, Kevin Park, Saurabh Vats, Ismail H. Ozguc |
2025-08-26 |
|
| 12401006 |
Electrical interconnects for packages containing photonic integrated circuits |
Matteo Staffaroni, Kevin Park, Saurabh Vats, Ismail H. Ozguc |
2025-08-26 |
|
| 12399333 |
Optical multi-die interconnect bridge with electrical and optical interfaces |
Philip Winterbottom, David E. Lazovsky, Ankur Aggarwal, Martinus Bos |
2025-08-26 |
|
| 12392974 |
Embedding a photonic integrated circuit in a semiconductor package for high bandwidth memory and compute |
Ankur Aggarwal, Philip Winterbottom, Martinus Bos |
2025-08-19 |
|
| 12306437 |
Temperature-stabilized integrated waveguides |
Kamal V. Karimanal, Gianlorenzo Masini, Attila Mekis, Roman Bruck |
2025-05-20 |
|
| 12298608 |
Optically bridged multicomponent package with extended temperature range |
Philip Winterbottom, David E. Lazovsky, Ankur Aggarwal, Martinus Bos |
2025-05-13 |
|
| 12242122 |
Multicomponent photonically intra-die bridged assembly |
Philip Winterbottom, David E. Lazovsky, Ankur Aggarwal, Martinus Bos |
2025-03-04 |
|
| 12216318 |
Optical bridging element for separately stacked electrical ICs |
Philip Winterbottom, David E. Lazovsky, Ankur Aggarwal, Martinus Bos |
2025-02-04 |
|
| 12197023 |
Manufacturing optically accessible co-packaged optics |
Ankur Aggarwal, Philip Winterbottom |
2025-01-14 |
|
| 12189198 |
Manufacturing optically accessible co-packaged optics |
Ankur Aggarwal |
2025-01-07 |
|
| 12164162 |
Multicomponent photonically bridged assembly |
Philip Winterbottom, David E. Lazovsky, Ankur Aggarwal, Martinus Bos |
2024-12-10 |
|
| 12164161 |
Stacked-dies optically bridged multicomponent package |
Philip Winterbottom, David E. Lazovsky, Ankur Aggarwal, Martinus Bos |
2024-12-10 |
|
| 12160273 |
Multi-protocol optical device |
Brian Welch |
2024-12-03 |
$37,655,000 |
| 12124095 |
Optical multi-die interconnect bridge with optical interface |
Philip Winterbottom, David E. Lazovsky, Ankur Aggarwal, Martinus Bos |
2024-10-22 |
|
| 11860412 |
Temperature-stabilized integrated waveguides |
Kamal V. Karimanal, Gianlorenzo Masini, Attila Mekis, Roman Bruck |
2024-01-02 |
$26,269,000 |
