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Martinus Bos — 27 Patents

CACelestial Ai: 16 patents #2 of 21Top 10%

DBDsm Ip Assets B.V.: 3 patents #458 of 2,011Top 25%

MGMitsubishi Chemical Europe Gmbh: 1 patents #2 of 6Top 35%

NANokia Of America: 1 patents #97 of 257Top 40%

San Jose, CA: #2,317 of 32,062 inventorsTop 8%

California: #19,967 of 386,348 inventorsTop 6%

Overall (All Time): #142,059 of 4,157,543Top 4%

27 Patents All Time

Martinus Bos has been granted 27 US patents while listed as an inventor at Celestial Ai. The first was granted in 2004 and the most recent in November 2025. Martinus Bos ranks #142,059 of 4,157,543 US inventors in our database (top 3.4%). Patent records list Martinus Bos in San Jose, CA, US.

Patents per Year

Issued Patents All Time

Showing 1–25 of 27 patents

Patent #	Title	Co-Inventors	Date
12468103	Optically bridged multicomponent package with extended temperature range	Philip Winterbottom, David E. Lazovsky, Ankit Aggarwal, Subal Sahni	2025-11-11
12443000	Optically bridged multicomponent package with extended temperature range	Philip Winterbottom, David E. Lazovsky, Ankit Aggarwal, Subal Sahni	2025-10-14
12442997	Optically bridged multicomponent package with extended temperature range	Philip Winterbottom, David E. Lazovsky, Ankit Aggarwal, Subal Sahni	2025-10-14
12442998	Optically bridged multicomponent package with extended temperature range	Philip Winterbottom, David E. Lazovsky, Ankit Aggarwal, Subal Sahni	2025-10-14
12442999	Optically bridged multicomponent package with extended temperature range	Philip Winterbottom, David E. Lazovsky, Ankit Aggarwal, Subal Sahni	2025-10-14
12436346	Optically bridged multicomponent package with extended temperature range	Philip Winterbottom, David E. Lazovsky, Ankit Aggarwal, Subal Sahni	2025-10-07
12405434	Embedding a photonic integrated circuit in a semiconductor package for high bandwidth memory and compute	Ankur Aggarwal, Subal Sahni, Philip Winterbottom	2025-09-02
12399333	Optical multi-die interconnect bridge with electrical and optical interfaces	Philip Winterbottom, David E. Lazovsky, Ankur Aggarwal, Subal Sahni	2025-08-26
12392974	Embedding a photonic integrated circuit in a semiconductor package for high bandwidth memory and compute	Ankur Aggarwal, Subal Sahni, Philip Winterbottom	2025-08-19
12353006	Electro-photonic network for machine learning	Philip Winterbottom	2025-07-08
12339490	Clock signal distribution using photonic fabric	Philip Winterbottom	2025-06-24
12339492	Electro-photonic network for machine learning	Philip Winterbottom	2025-06-24
12298608	Optically bridged multicomponent package with extended temperature range	Philip Winterbottom, David E. Lazovsky, Ankur Aggarwal, Subal Sahni	2025-05-13
12271595	Photonic memory fabric for system memory interconnection	David E. Lazovsky, Philip Winterbottom	2025-04-08
12259575	Clock signal distribution using photonic fabric	Philip Winterbottom, Jason Redgrave	2025-03-25
12242122	Multicomponent photonically intra-die bridged assembly	Philip Winterbottom, David E. Lazovsky, Ankur Aggarwal, Subal Sahni	2025-03-04
12216318	Optical bridging element for separately stacked electrical ICs	Philip Winterbottom, David E. Lazovsky, Ankur Aggarwal, Subal Sahni	2025-02-04
12164161	Stacked-dies optically bridged multicomponent package	Philip Winterbottom, David E. Lazovsky, Ankur Aggarwal, Subal Sahni	2024-12-10
12164162	Multicomponent photonically bridged assembly	Philip Winterbottom, David E. Lazovsky, Ankur Aggarwal, Subal Sahni	2024-12-10
12124095	Optical multi-die interconnect bridge with optical interface	Philip Winterbottom, David E. Lazovsky, Ankur Aggarwal, Subal Sahni	2024-10-22
11835777	Optical multi-die interconnect bridge (OMIB)	Philip Winterbottom, David E. Lazovsky, Ankur Aggarwal, Subal Sahni	2023-12-05
11509397	Balanced photonic architectures for matrix computations	Yangjin Ma, Nikolaos Pleros, David E. Lazovsky, George Giamougiannis, Apostolos Tsakyridis +2 more	2022-11-22
10237587	Transporting out-of-band signals in distributed cable systems	Gino Pedro Enrique Rea Zanabria	2019-03-19
8916637	Aromatic polycarbonate composition	Edwin Van Hartingsveldt	2014-12-23
7446141	Thermoplastic composition comprising an aromatic polycarbonate and/or a polyester with improved mould release behaviour	Edwin Van Hartingsveldt	2008-11-04