| 12468103 |
Optically bridged multicomponent package with extended temperature range |
Philip Winterbottom, Ankit Aggarwal, Martinus Bos, Subal Sahni |
2025-11-11 |
|
| 12443000 |
Optically bridged multicomponent package with extended temperature range |
Philip Winterbottom, Ankit Aggarwal, Martinus Bos, Subal Sahni |
2025-10-14 |
|
| 12442999 |
Optically bridged multicomponent package with extended temperature range |
Philip Winterbottom, Ankit Aggarwal, Martinus Bos, Subal Sahni |
2025-10-14 |
|
| 12442998 |
Optically bridged multicomponent package with extended temperature range |
Philip Winterbottom, Ankit Aggarwal, Martinus Bos, Subal Sahni |
2025-10-14 |
|
| 12442997 |
Optically bridged multicomponent package with extended temperature range |
Philip Winterbottom, Ankit Aggarwal, Martinus Bos, Subal Sahni |
2025-10-14 |
|
| 12436346 |
Optically bridged multicomponent package with extended temperature range |
Philip Winterbottom, Ankit Aggarwal, Martinus Bos, Subal Sahni |
2025-10-07 |
|
| 12399333 |
Optical multi-die interconnect bridge with electrical and optical interfaces |
Philip Winterbottom, Ankur Aggarwal, Martinus Bos, Subal Sahni |
2025-08-26 |
|
| 12298608 |
Optically bridged multicomponent package with extended temperature range |
Philip Winterbottom, Ankur Aggarwal, Martinus Bos, Subal Sahni |
2025-05-13 |
|
| 12271595 |
Photonic memory fabric for system memory interconnection |
Philip Winterbottom, Martinus Bos |
2025-04-08 |
|
| 12242122 |
Multicomponent photonically intra-die bridged assembly |
Philip Winterbottom, Ankur Aggarwal, Martinus Bos, Subal Sahni |
2025-03-04 |
|
| 12216318 |
Optical bridging element for separately stacked electrical ICs |
Philip Winterbottom, Ankur Aggarwal, Martinus Bos, Subal Sahni |
2025-02-04 |
|
| 12164161 |
Stacked-dies optically bridged multicomponent package |
Philip Winterbottom, Ankur Aggarwal, Martinus Bos, Subal Sahni |
2024-12-10 |
|
| 12164162 |
Multicomponent photonically bridged assembly |
Philip Winterbottom, Ankur Aggarwal, Martinus Bos, Subal Sahni |
2024-12-10 |
|
| 12124095 |
Optical multi-die interconnect bridge with optical interface |
Philip Winterbottom, Ankur Aggarwal, Martinus Bos, Subal Sahni |
2024-10-22 |
|
| 11835777 |
Optical multi-die interconnect bridge (OMIB) |
Philip Winterbottom, Ankur Aggarwal, Martinus Bos, Subal Sahni |
2023-12-05 |
|
| 11817903 |
Coherent photonic computing architectures |
Nikolaos Pleros, George Giamougiannis, Apostolos Tsakyridis, Angelina Totovic |
2023-11-14 |
|
| 11509397 |
Balanced photonic architectures for matrix computations |
Yangjin Ma, Nikolaos Pleros, George Giamougiannis, Apostolos Tsakyridis, Angelina Totovic +2 more |
2022-11-22 |
|
| 9368400 |
Formation of a masking layer on a dielectric region to facilitate formation of a capping layer on electrically conductive regions separated by the dielectric region |
Thomas R. Boussie, Sandra G. Malhotra |
2016-06-14 |
$337,000 |
| 9362231 |
Molecular self-assembly in substrate processing |
Tony P. Chiang, Majid Keshavarz |
2016-06-07 |
$578,000 |
| 9331279 |
Creating an embedded ReRAM memory from a high-k metal gate transistor structure |
Dipankar Pramanik, Tony P. Chiang |
2016-05-03 |
$352,000 |
| 9275954 |
Molecular self-assembly in substrate processing |
Tony P. Chiang, Majid Keshavarz |
2016-03-01 |
$206,000 |
| 9275727 |
Multi-level memory array having resistive elements for multi-bit data storage |
Dipankar Pramanik, Tim Minvielle, Takeshi Yamaguchi |
2016-03-01 |
$206,000 |
| 9076716 |
Methods for discretized processing and process sequence integration of regions of a substrate |
Thomas R. Boussie, Tony P. Chiang, Alexander Gorer |
2015-07-07 |
$253,000 |
| 9054032 |
Creating an embedded ReRAM memory from a high-k metal gate transistor structure |
Dipankar Pramanik, Tony P. Chiang |
2015-06-09 |
$393,000 |
| 8995166 |
Multi-level memory array having resistive elements for multi-bit data storage |
Dipankar Pramanik, Tim Minvielle, Takeshi Yamaguchi |
2015-03-31 |
|
