Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Dual-sided co-packaged optics for high bandwidth networking applications

Dual-sided co-packaged optics for high bandwidth networking applications

US Patent 11830863 · Granted Nov 28, 2023

Estimated economic value: $31,872,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Liquid metal interconnect for modular package server architecture2025
Package architecture of photonic system with vertically stacked dies having plan2025
Package architecture of scalable compute wall having compute bricks with vertica2025
Method and device for fast, passive alignment in photonics assembly2025
Preserving access to optical components on a wafer package with sacrificial cap2025
Preserving access to optical components on a wafer package with sacrificial die2025
Liquid metal interconnect for modular system on an interposer server architectur2025
BGA stiffener attachment with low Eolife adhesive strength at high solder joint 2025
Silicon photonic systems for LIDAR applications2025
Moisture seal coating of hybrid bonded stacked die package assembly2025
Heterogenous socket contact for electrical and mechanical performance scaling in2025
Photonic integrated circuit packaging architectures2025