Issued Patents All Time
Showing 26–50 of 85 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11923307 | Microelectronic structures including bridges | Bai Nie, Gang Duan, Nitin A. Deshpande, Yikang Deng, Wei-Lun Kane Jen +6 more | 2024-03-05 |
| 11887962 | Microelectronic structures including bridges | Nitin A. Deshpande, Mohit Bhatia, Sairam Agraharam, Edvin Cetegen, Anurag Tripathi +6 more | 2024-01-30 |
| 11854945 | Underfill material flow control for reduced die-to-die spacing in semiconductor packages | Nitin A. Deshpande, Rajendra C. Dias, Edvin Cetegen, Lars D. Skoglund | 2023-12-26 |
| 11804456 | Wirebond and leadframe magnetic inductors | William J. Lambert, Martin Rodriguez, Gregorio R. Murtagian | 2023-10-31 |
| 11804441 | Microelectronic structures including bridges | Nitin A. Deshpande, Mohit Bhatia, Debendra Mallik | 2023-10-31 |
| 11791274 | Multichip semiconductor package including a bridge die disposed in a cavity having non-planar interconnects | Manish Dubey, Nitin A. Deshpande, Jinhe Liu, Sairam Agraharam, Mohit Bhatia +1 more | 2023-10-17 |
| 11764080 | Low cost package warpage solution | Nitin A. Deshpande, Debendra Mallik, Bassam M. Ziadeh, Yoshihiro Tomita | 2023-09-19 |
| 11735558 | Microelectronic structures including bridges | Nitin A. Deshpande, Mohit Bhatia, Anurag Tripathi, Takeshi Nakazawa, Steve Cho | 2023-08-22 |
| 11735495 | Active package cooling structures using molded substrate packaging technology | Mitul Modi, Edvin Cetegen, Aastha Uppal | 2023-08-22 |
| 11676900 | Electronic assembly that includes a bridge | Eric J. Li, Nitin A. Deshpande, Shawna M. Liff, Amram Eitan, Timothy A. Gosselin | 2023-06-13 |
| 11616283 | 5G mmWave antenna architecture with thermal management | William J. Lambert, Xiaoqian Li, Sidharth Dalmia | 2023-03-28 |
| 11611164 | Wideband multi-pin edge connector for radio frequency front end module | Zhenguo Jiang, Sri Chaitra Jyotsna Chavali, William J. Lambert, Zhichao Zhang, Mitul Modi | 2023-03-21 |
| 11581240 | Liquid thermal interface material in electronic packaging | Kedar Dhane, Aravindha R. Antoniswamy, Divya Mani | 2023-02-14 |
| 11574851 | Coupled cooling fins in ultra-small systems | Aastha Uppal, Ram Viswanath, Je-Young Chang, Weihua Tang, Nitin A. Deshpande +6 more | 2023-02-07 |
| 11552035 | Electronic package with stud bump electrical connections | Zhaozhi Li, Sanka Ganesan, Debendra Mallik, Gregory Perry, Kuan-Hsun Lu +1 more | 2023-01-10 |
| 11545407 | Thermal management solutions for integrated circuit packages | Kumar Abhishek Singh, Nitin A. Deshpande, Mitul Modi, Edvin Cetegen, Aastha Uppal +8 more | 2023-01-03 |
| 11521931 | Microelectronic structures including bridges | Jason M. Gamba, Nitin A. Deshpande, Mohit Bhatia, Bai Nie, Gang Duan +2 more | 2022-12-06 |
| 11522291 | Antenna boards and communication devices | William J. Lambert, Xiaoqian Li, Nitin A. Deshpande, Debendra Mallik | 2022-12-06 |
| 11430724 | Ultra-thin, hyper-density semiconductor packages | Debendra Mallik, Robert L. Sankman, Robert M. Nickerson, Mitul Modi, Sanka Ganesan +4 more | 2022-08-30 |
| 11417592 | Methods of utilizing low temperature solder assisted mounting techniques for package structures | Nachiket R. Raravikar, Sandeep B. Sane | 2022-08-16 |
| 11373972 | Microelectronic structures including bridges | Nitin A. Deshpande, Mohit Bhatia, Anurag Tripathi, Takeshi Nakazawa, Steve Cho | 2022-06-28 |
| 11328937 | Low cost package warpage solution | Nitin A. Deshpande, Debendra Mallik, Bassam M. Ziadeh, Yoshihiro Tomita | 2022-05-10 |
| 11254563 | Mold material architecture for package device structures | Nitin A. Deshpande | 2022-02-22 |
| 11222877 | Thermally coupled package-on-package semiconductor packages | Robert L. Sankman, Nitin A. Deshpande, Mitul Modi, Thomas J. De Bonis, Robert M. Nickerson +6 more | 2022-01-11 |
| 11127706 | Electronic package with stud bump electrical connections | Zhaozhi Li, Sanka Ganesan, Debendra Mallik, Gregory Perry, Kuan-Hsun Lu +1 more | 2021-09-21 |